An indicator based on the present invention for indicating the adhesion status between a substrate and the encapsulation layer of a packaged electronic device is characterized in that at least one indicating pattern and one indicating region surrounding the indicating pattern are formed on the substrate, the adhesion between the indicating pattern and the encapsulant is very good while that between the indicating region and the encapsulant is relatively poor, both the indicating pattern and the indicating region are covered by molding encapsulant which is stripped off when having become hardening, thereby the status of the indicating pattern appearing after stripping off the encapsulant can indicate the adhesion quality (integration quality) between the encapsulation layer and the substrate. The indicator realizes a non-destructive quality checking process in which each electronic device can be checked to achieve one hundred percent of quality control.