Invention Grant
- Patent Title: Grindstone and method of manufacturing the same
- Patent Title (中): 磨石及其制造方法
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Application No.: US957929Application Date: 1997-10-27
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Publication No.: US6071182APublication Date: 2000-06-06
- Inventor: Katsuji Sunagawa
- Applicant: Katsuji Sunagawa
- Applicant Address: JPX Kyoto
- Assignee: Sanwa Kenma Kogyo Co., Ltd.
- Current Assignee: Sanwa Kenma Kogyo Co., Ltd.
- Current Assignee Address: JPX Kyoto
- Priority: JPX9-010416 19970123
- Main IPC: B24B13/01
- IPC: B24B13/01 ; B24D7/06 ; B24D13/14 ; B24B21/00
Abstract:
A sheet-shaped grindstone for grinding a workpiece includes a plurality of segments arranged in an appropriate pattern with sufficient spaces therebetween such that the grindstone becomes flexible. The segments are formed in a manner in which metal powder including diamond grinding grains is sintered to form granular chips, the chips are disposed in a die in such a density that the chips come into mutual contact, and gaps around the granular chips are filled with a resin through application of pressure. The grindstone is more flexible at contact points with a workpiece than are conventional vitrified grinding tools. The grindstone can evade collision of the segments with the workpiece and can grind a curved surface of the workpiece through smooth contact therewith.
Public/Granted literature
- US5693864A Process for the production of secondary amine terminated polyethers Public/Granted day:1997-12-02
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