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公开(公告)号:USD609545S1
公开(公告)日:2010-02-09
申请号:US29331843
申请日:2009-02-03
申请人: Kazuhisa Ueno , Katsuji Sunagawa , Izumi Araki , Eiki Sakaguchi
设计人: Kazuhisa Ueno , Katsuji Sunagawa , Izumi Araki , Eiki Sakaguchi
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公开(公告)号:USD444483S1
公开(公告)日:2001-07-03
申请号:US29127183
申请日:2000-08-02
申请人: Katsuji Sunagawa
设计人: Katsuji Sunagawa
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公开(公告)号:USD486839S1
公开(公告)日:2004-02-17
申请号:US29175294
申请日:2003-02-01
申请人: Katsuji Sunagawa , Hisayuki Murata
设计人: Katsuji Sunagawa , Hisayuki Murata
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公开(公告)号:US6071182A
公开(公告)日:2000-06-06
申请号:US957929
申请日:1997-10-27
申请人: Katsuji Sunagawa
发明人: Katsuji Sunagawa
摘要: A sheet-shaped grindstone for grinding a workpiece includes a plurality of segments arranged in an appropriate pattern with sufficient spaces therebetween such that the grindstone becomes flexible. The segments are formed in a manner in which metal powder including diamond grinding grains is sintered to form granular chips, the chips are disposed in a die in such a density that the chips come into mutual contact, and gaps around the granular chips are filled with a resin through application of pressure. The grindstone is more flexible at contact points with a workpiece than are conventional vitrified grinding tools. The grindstone can evade collision of the segments with the workpiece and can grind a curved surface of the workpiece through smooth contact therewith.
摘要翻译: 用于研磨工件的片状磨石包括以适当的图案布置的多个片段,其间具有足够的间隔,使得磨石变得柔性。 以这样的方式形成片段,其中包括金刚石研磨颗粒的金属粉末被烧结以形成颗粒状碎屑,将芯片以这样的密度设置在模具中,使得芯片相互接触,并且颗粒状芯片周围的间隙被填充 树脂通过施加压力。 与传统的玻璃磨削工具相比,磨石在与工件的接触点处更灵活。 磨石可以避免切割段与工件的碰撞,并可以通过与工件的平滑接触来研磨工件的曲面。
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公开(公告)号:US06273805B1
公开(公告)日:2001-08-14
申请号:US09377874
申请日:1999-08-20
申请人: Katsuji Sunagawa
发明人: Katsuji Sunagawa
IPC分类号: B24B2100
摘要: A sheet-shaped grindstone for grinding a workpiece includes a plurality of segments arranged in an appropriate pattern with sufficient spaces therebetween such that the grindstone becomes flexible. The segments are formed in a manner in which metal powder including diamond grinding grains is sintered to form granular chips, the chips are disposed in a die in such a density that the chips come into mutual contact, and gaps around the granular chips are filled with a resin through application of pressure. The grindstone is more flexible at contact points with a workpiece than are conventional vitrified grinding tools. The grindstone can evade collision of the segments with the workpiece and can grind a curved surface of the workpiece through smooth contact therewith.
摘要翻译: 用于研磨工件的片状磨石包括以适当的图案布置的多个片段,其间具有足够的间隔,使得磨石变得柔性。 以这样的方式形成片段,其中包括金刚石研磨颗粒的金属粉末被烧结以形成颗粒状碎屑,将芯片以这样的密度设置在模具中,使得芯片相互接触,并且颗粒状芯片周围的间隙被填充 树脂通过施加压力。 与传统的玻璃磨削工具相比,磨石在与工件的接触点处更灵活。 磨石可以避免切割段与工件的碰撞,并可以通过与工件的平滑接触来研磨工件的曲面。
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