This discloses an electronic component of a miniature size to be used as e.g. automobile engine peripheral components, such as an exhaust gas oxygen sensor, a heat sensor, and a heater. More specifically, the invention provides an electronic component integral with a heat resistant terminal that is pressure-fitting or shrink-fitted on a ceramic element of the electronic component. This electronic components shows great mechanical and electrical performance, withstanding the high temperature environment over 400 and up to 800.degree. C. to which the ceramic element of the component required expose.The terminal incorporated in this high temperature electronic component comprises a plurality of metal wire leads that electrically connect to a surface of a bar-like ceramic element, at least two ceramic insulators that surround the leads, and a thermal resistant metal ring that shrink-fits or pressure-fits around the ceramic insulators so that the metal leads press in a radial direction holding the element firmly.The thermal resistant metal ring to be used for this shrink fit or pressure fit is preferably made of an alloy, such as Incoloy 909, Inconel 650, and Waspaloy, and the like, thereby preventing the metal leads from coming off at high temperature.The terminal integrated with the ceramic element by the shrink fitting method according to the invention, minimizes the number of parts, attaining a miniaturization of such high temperature electronic component at a low cost.