The present invention relates to a bonded assembly characterized in that a board having a convexed portion on a jointing surface thereof and a board having, on a jointing surface thereof, a concaved portion or a through hole to be engaged with the convexed portion are jointed with adhesives. Also, the present invention relates to a bonded assembly characterized in that an adhesive is coated on the portion other than the convexed portion of the board so that the coating thickness is smaller than the height of the convexed portion, and then the board is jointed to another board having a concaved portion or a through hole, after making alignment of the boards. Further, the present invention relates to a rivet having means for fitting to and temporarily fixing to an inserting through hole, and a method of jointing boards which comprises a step for inserting, fitting and temporarily fixing the rivet having the means for temporarily fixing to the inserting through hole on the board. The present invention can provide a highly reliable bonded assembly, a method of jointing boards therefor and a rivet for facilitating jointing the boards, which assure easy and accurate alignment of the boards, secure an adhesive coating thickness required, prevent the adhesive from adhering to unnecessary portions and increase the strength as the bonded assembly.