-
公开(公告)号:US5776584A
公开(公告)日:1998-07-07
申请号:US545276
申请日:1995-10-19
申请人: Kosuke Haraga , Naoki Yagi , Yoshinobu Nakashima , Yuzi Ganryu , Tsutomu Sasaki , Atsushi Takimoto , Yosiro Komazawa , Asao Okuda , Shoji Takagi , Akifumi Matsukawa , Hideaki Urata , Yasushi Kawashima , Kazumi Masuo , Kenji Honma , Isao Ikeda
发明人: Kosuke Haraga , Naoki Yagi , Yoshinobu Nakashima , Yuzi Ganryu , Tsutomu Sasaki , Atsushi Takimoto , Yosiro Komazawa , Asao Okuda , Shoji Takagi , Akifumi Matsukawa , Hideaki Urata , Yasushi Kawashima , Kazumi Masuo , Kenji Honma , Isao Ikeda
IPC分类号: F16B5/00 , F16B5/04 , F16B11/00 , F16B17/00 , F16B19/06 , F16B19/10 , H02B1/30 , F16B1/48 , B32B3/26
CPC分类号: F16B19/1045 , F16B5/00 , F16B5/04 , F16B11/006 , F16B17/008 , F16B19/06 , F16B2200/30 , Y10T403/7073 , Y10T428/24281 , Y10T428/24289 , Y10T428/24339 , Y10T428/24347 , Y10T428/24521 , Y10T428/24529
摘要: The present invention relates to a bonded assembly characterized in that a board having a convexed portion on a jointing surface thereof and a board having, on a jointing surface thereof, a concaved portion or a through hole to be engaged with the convexed portion are jointed with adhesives. Also, the present invention relates to a bonded assembly characterized in that an adhesive is coated on the portion other than the convexed portion of the board so that the coating thickness is smaller than the height of the convexed portion, and then the board is jointed to another board having a concaved portion or a through hole, after making alignment of the boards. Further, the present invention relates to a rivet having means for fitting to and temporarily fixing to an inserting through hole, and a method of jointing boards which comprises a step for inserting, fitting and temporarily fixing the rivet having the means for temporarily fixing to the inserting through hole on the board. The present invention can provide a highly reliable bonded assembly, a method of jointing boards therefor and a rivet for facilitating jointing the boards, which assure easy and accurate alignment of the boards, secure an adhesive coating thickness required, prevent the adhesive from adhering to unnecessary portions and increase the strength as the bonded assembly.
-
2.
公开(公告)号:US6083604A
公开(公告)日:2000-07-04
申请号:US545276
申请日:1995-10-19
申请人: Kosuke Haraga , Naoki Yagi , Yoshinobu Nakashima , Yuzi Ganryu , Tsutomu Sasaki , Atsushi Takimoto , Yosiro Komazawa , Asao Okuda , Shoji Takagi , Akifumi Matsukawa , Hideaki Urata , Yasushi Kawashima , Kazumi Masuo , Kenji Honma , Isao Ikeda
发明人: Kosuke Haraga , Naoki Yagi , Yoshinobu Nakashima , Yuzi Ganryu , Tsutomu Sasaki , Atsushi Takimoto , Yosiro Komazawa , Asao Okuda , Shoji Takagi , Akifumi Matsukawa , Hideaki Urata , Yasushi Kawashima , Kazumi Masuo , Kenji Honma , Isao Ikeda
IPC分类号: F16B5/00 , F16B5/04 , F16B11/00 , F16B17/00 , F16B19/06 , F16B19/10 , H02B1/30 , F16B1/48 , B32B3/26
CPC分类号: F16B19/1045 , F16B11/006 , F16B17/008 , F16B19/06 , F16B5/00 , F16B5/04 , Y10T403/7073 , Y10T403/7094 , Y10T428/24281 , Y10T428/24289 , Y10T428/24339 , Y10T428/24347 , Y10T428/24521 , Y10T428/24529
摘要: The present invention relates to a bonded assembly characterized in that a board having a convexed portion on a jointing surface thereof and a board having, on a jointing surface thereof, a concaved portion or a through hole to be engaged with the convexed portion are jointed with adhesives. Also, the present invention relates to a bonded assembly characterized in that an adhesive is coated on the portion other than the convexed portion of the board so that the coating thickness is smaller than the height of the convexed portion, and then the board is jointed to another board having a concaved portion or a through hole, after making alignment of the boards. Further, the present invention relates to a rivet having means for fitting to and temporarily fixing to an inserting through hole, and a method of jointing boards which comprises a step for inserting, fitting and temporarily fixing the rivet having the means for temporarily fixing to the inserting through hole on the board. The present invention can provide a highly reliable bonded assembly, a method of jointing boards therefor and a rivet for facilitating jointing the boards, which assure easy and accurate alignment of the boards, secure an adhesive coating thickness required, prevent the adhesive from adhering to unnecessary portions and increase the strength as the bonded assembly.
摘要翻译: 本发明涉及一种接合组件,其特征在于,在其接合表面上具有凸起部分的板和在其接合表面上具有与凸起部分接合的凹部或通孔的基板与 粘合剂。 另外,本发明涉及一种接合组件,其特征在于,在所述板的凸部以外的部分涂布粘接剂,使得所述涂布厚度小于所述凸部的高度,然后将所述基板接合到 在板对准之后具有凹部或通孔的另一板。 此外,本发明涉及一种铆钉,其具有用于装配并临时固定到插入通孔的装置,以及一种连接板的方法,包括用于将具有临时固定装置的铆钉插入,装配和临时固定的步骤, 插入板上的通孔。 本发明可以提供高可靠性的接合组件,其连接板的方法和用于便于连接板的铆钉,这确保板的容易和精确的对准,确保所需的粘合剂涂层厚度,防止粘合剂粘附到不必要的 部分并增加作为粘结组件的强度。
-