Invention Grant
- Patent Title: Method for fabricating a very dense chip package
- Patent Title (中): 制造非常密集的芯片封装的方法
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Application No.: US18737Application Date: 1998-02-04
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Publication No.: US6087199APublication Date: 2000-07-11
- Inventor: H. Bernhard Pogge , Bijan Davari , Johann Greschner , Howard L. Kalter
- Applicant: H. Bernhard Pogge , Bijan Davari , Johann Greschner , Howard L. Kalter
- Applicant Address: NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: NY Armonk
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L21/98 ; H01L23/13 ; H01L25/065 ; H01L29/06 ; H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
A method for fabricating an integrated circuit package or arrangement includes providing a carrier having a surface topography of projections or recesses for supporting individual semiconductor circuit chips having conversely matching bottom surface topographies to permit self-aligned positioning of the chip on the carrier. Chips are provided such that top faces of neighboring chips lie substantially in planes separated by a distance of greater than 0.0 .mu.m. The carrier is arranged and dimensioned such that the neighboring chips are separated by a gap G or spacing in a range of 1 .mu.m
Public/Granted literature
- USD354993S Hand held electronic game housing Public/Granted day:1995-01-31
Information query
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