A thermoelectric module having a high thermoelectric performance is shown and described. A flat thermoelectric module comprises a multi-layered body provided with a thermoelectric material layer having output take-out faces on two opposite sides, an electrode layer present on each output take-out faces, a metallic layer present on each electrode layer, and an electrical insulating outer layer covering the surface of the body. Adjacent layers are pressure-welded to be in close contact with each other. No solder is used in the construction of a module in accordance with the present invention, and it is therefore possible to improve the thermoelectric performance of the module by raising the operating temperature without being restricted by the melting point of solder.