Invention Grant
- Patent Title: Probe card and wafer testing method using the same
- Patent Title (中): 探针卡和晶圆测试方法使用相同
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Application No.: US037511Application Date: 1998-03-10
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Publication No.: US6100708APublication Date: 2000-08-08
- Inventor: Masaharu Mizuta
- Applicant: Masaharu Mizuta
- Applicant Address: JPX Tokyo
- Assignee: Mitsubishi Denki Kabushiki Kaisha
- Current Assignee: Mitsubishi Denki Kabushiki Kaisha
- Current Assignee Address: JPX Tokyo
- Priority: JPX9-262305 19970926
- Main IPC: G01R1/073
- IPC: G01R1/073 ; H01L21/66 ; G01R31/02
Abstract:
A probe needle has one end and the other end. Probe needle has its one end fixed to the bottom surface of a substrate, and extending at a prescribed angle to substrate. A portion of probe needle positioned between the one end and the other end is pressed by a rod attacked between a pair of pillow toward substrate. Thus, an improved probe card which permits appropriate pressure needle to be provided even if the variation in the height of probe needles is large.
Public/Granted literature
- USD369405S Combined motor housing and blade irons unit for an electric ceiling fan Public/Granted day:1996-04-30
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