Invention Grant
US6103450A Photosensitive polymer, dissolution inhibitor and chemically amplified
photoresist composition containing the same
失效
光敏聚合物，溶解抑制剂和含有它们的化学放大光致抗蚀剂组合物
- Patent Title: Photosensitive polymer, dissolution inhibitor and chemically amplified photoresist composition containing the same
- Patent Title (中): 光敏聚合物，溶解抑制剂和含有它们的化学放大光致抗蚀剂组合物
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Application No.: US276735Application Date: 1999-03-26
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Publication No.: US6103450APublication Date: 2000-08-15
- Inventor: Sang-jun Choi
- Applicant: Sang-jun Choi
- Applicant Address: KRX Kyungki-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KRX Kyungki-do
- Priority: KRX98-21761 19980611
- Main IPC: C08F32/04
- IPC: C08F32/04 ; C08K5/15 ; C08K5/17 ; C08L45/00 ; C09D137/00 ; G03F7/004 ; G03F7/039 ; H01L21/027 ; G03C1/73
Abstract:
A photosensitive polymer, a dissolution inhibitor, and a chemically amplified photoresist composition containing the photosensitive polymer and the dissolution inhibitor are provided. The photosensitive polymer is a copolymer polymerized with 5-norbornene-2-methanol derivative monomer having a C.sub.1 to C.sub.20 aliphatic hydrocarbon as a side chain, and a maleic anhydride monomer. The dissolution inhibitor is a tricyclodecane derivative or a sarsasapogenin derivative, each having an acid-labile group as a functional group. The chemically amplified photoresist composition containing the photosensitive polymer and/or dissolution inhibitor has a strong resistance to etching and excellent adherence to underlying layer.
Public/Granted literature
- US5606485A Electrostatic chuck having improved erosion resistance Public/Granted day:1997-02-25
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