发明授权
US6104612A Clip-on heat sink 失效
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Clip-on heat sink
摘要:
The heat sink (10) of the present invention is used to absorb and dissipate heat from a solid-state device. The heat sink (10) comprises a generally U-shaped body (18) of a thermally conductive material. The U-shaped body (18) comprises two continuous legs (20, 22) having widths greater than the width of the solid-state device.
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