Conductive apparatus having minimized AC resistance. The conductive apparatus comprises a planar rectangular conductor having top and bottom surfaces, and opposed end surfaces that are smaller in dimension than the top and bottom surfaces. Magnetic material is disposed adjacent to each of the end surfaces of the rectangular conductor that is formed in a "C" shape to provide end caps that are symmetrical and enclose the end surfaces and portions of the top and bottom surfaces to overlap the conductor in its corners. A method of fabricating the conductive apparatus is also disclosed.