发明授权
- 专利标题： Transfer molding apparatus with a cull-block having protrusion
- 专利标题（中）： 具有突起的剔骨块的传送成型装置
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申请号： US160523申请日： 1998-09-24
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公开(公告)号： US6106259A公开(公告)日： 2000-08-22
- 发明人: Dae Sung Lee , Do Woo Lee , Hyun Woo Park
- 申请人： Dae Sung Lee , Do Woo Lee , Hyun Woo Park
- 申请人地址： KRX
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KRX
- 优先权： KRX97-69219 19971216
- 主分类号： B29C45/26
- IPC分类号： B29C45/26 ; B29C45/02 ; H01L21/56 ; H01L23/02
摘要：
A transfer molding apparatus with a specially designed cull-block can prevent the occurrence of defective molding caused by the air trapped inside the mold body. This cull-block has a cylindrical protrusion at the center of the cull-block and a circular sunken part along the perimeter of the protrusion. This new design prevents the air remaining behind the front of the fluid molding compound during molding process and finally, promotes the production of semiconductor device package free from molding defects.
公开/授权文献
- US5458187A Dual core air-to-air heat exchanger 公开/授权日：1995-10-17
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