- 专利标题: Mounting apparatus for electronic component
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申请号: US60330申请日: 1998-04-15
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公开(公告)号: US6115908A公开(公告)日: 2000-09-12
- 发明人: Yuzuru Inaba , Kiyoshi Imai , Hideaki Watanabe , Hiromi Kinoshita
- 申请人: Yuzuru Inaba , Kiyoshi Imai , Hideaki Watanabe , Hiromi Kinoshita
- 申请人地址: JPX Kadoma
- 专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址: JPX Kadoma
- 优先权: JPX7-34022 19950222
- 主分类号: B23P21/00
- IPC分类号: B23P21/00 ; H05K13/04 ; B23P19/00
摘要:
An apparatus is provided with a component feeding member for feeding electronic components having lead wires in a tape-bonded state, an insertion head for separating the electronic components fed from the feeding member from the tapes and inserting to holes of a board, and a fixing head facing the insertion head via the board for cutting and folding the lead wires of the inserted electronic component in the board thereby fixing the electronic component to the board. AC servo motors operating independently of each other are individually set in the insertion head and the fixing head, which are controlled by a device so as to be synchronous with each other.
公开/授权文献
- USD401859S Bottle 公开/授权日:1998-12-01