A composition for a transparent conductive layer, a transparent conductive layer formed of the composition, and a method for forming the transparent conductive layer. The composition comprises a metal (M.sub.1) particle, a binding agent and a solvent, wherein the metal (M.sub.1) particle has an average particle diameter of 10.about.30 nm and is at least one selected from the group consisting of gold (Au), silver (Ag), platinum (Pt), copper (Cu), nickel (Ni), lead (Pb), cobalt (Co), rhodium (Rh), ruthenium (Ru), palladium (Pd) and tin (Sn), and wherein the binding agent is at least one compound selected from the group consisting of polypyrrole, polyvinylpyrrolidone, polyvinylalcohol and silicon alkoxide oligomer. Therefore, the transparent conductive layer which is excellent in conductivity and transmittance can be formed by a low-temperature sintering process.