A flexible printed circuit having wiring patterns printed on a flexible resin film, comprising a narrow flexible area having first wiring patterns and constituting a flexible wiring part and a broad connection area adapted to be adhered to a main board and having second wiring patterns connected to the first wiring patterns and adapted to be electrically connected to wiring patterns on the main board. The second wiring patterns serve to electrically connect the first wiring patterns of the flexible wiring part to the wiring patterns on the main board. Also included is a conductive adhesion surface formed on the broad connection area along a side of the main board, having a width larger than a width of the first wiring patterns, and extending from an inside of a region to an outside thereof. The region is defined in the broad connection area by extending a boundary of the flexible area into the broad connection area. A flexible printed circuit can be provided which has a high peel-off resistance to an applied stress.