发明授权
- 专利标题： Heat sink chip package and method of making
- 专利标题（中）： 散热片芯片封装及制作方法
-
申请号： US364351申请日： 1999-07-30
-
公开(公告)号： US6122171A公开(公告)日： 2000-09-19
- 发明人: Salman Akram , Larry Kinsman
- 申请人： Salman Akram , Larry Kinsman
- 专利权人： Micron Technology, Inc.
- 当前专利权人： Micron Technology, Inc.
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L25/10 ; H05K7/20
摘要：
The present invention relates to enhanced thermal management of a microelectronic device package on a printed circuit board (PCB) having a solder ring or dam that encompasses a ball array. The ring or dam bears stress from disparate coefficients of mechanical expansion between the PCB and the ball array.
公开/授权文献
信息查询
IPC分类:
