公开(公告)号：US06563712B2

公开(公告)日：2003-05-13

申请号：US10147176

申请日：2002-05-16

申请人： Salman Akram ,  Larry Kinsman

发明人： Salman Akram ,  Larry Kinsman

IPC分类号： H05K720

CPC分类号： H01L24/97 ,  H01L23/3121 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： The present invention relates to enhanced thermal management of a microelectronic device package on a printed circuit board (PCB) having a solder ring or dam that encompasses a ball array. The ring or dam bears stress from disparate coefficients of mechanical expansion between the PCB and the ball array.

摘要翻译： 本发明涉及在具有包围球阵列的焊锡环或水坝的印刷电路板（PCB）上的微电子器件封装的增强的热管理。 环或水坝承受来自PCB和球阵列之间机械膨胀的不同系数的应力。

公开(公告)号：US06426875B1

公开(公告)日：2002-07-30

申请号：US09651330

申请日：2000-08-29

申请人： Salman Akram ,  Larry Kinsman

发明人： Salman Akram ,  Larry Kinsman

IPC分类号： H05K720

CPC分类号： H01L24/97 ,  H01L23/3121 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： The present invention relates to enhanced thermal management of a microelectronic device package on a printed circuit board (PCB) having a solder ring or dam that encompasses a ball array. The ring or dam bears stress from disparate coefficients of mechanical expansion between the PCB and the ball array.

公开(公告)号：US6122171A

公开(公告)日：2000-09-19

申请号：US364351

申请日：1999-07-30

申请人： Salman Akram ,  Larry Kinsman

发明人： Salman Akram ,  Larry Kinsman

IPC分类号： H01L23/31 ,  H01L25/10 ,  H05K7/20

CPC分类号： H01L24/97 ,  H01L23/3121 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532

摘要： The present invention relates to enhanced thermal management of a microelectronic device package on a printed circuit board (PCB) having a solder ring or dam that encompasses a ball array. The ring or dam bears stress from disparate coefficients of mechanical expansion between the PCB and the ball array.

摘要翻译： 本发明涉及在具有包围球阵列的焊锡环或水坝的印刷电路板（PCB）上的微电子器件封装的增强的热管理。 环或水坝承受来自PCB和球阵列之间机械膨胀的不同系数的应力。

公开(公告)号：US6114770A

公开(公告)日：2000-09-05

申请号：US121272

申请日：1998-07-22

申请人： Salman Akram ,  Larry Kinsman

发明人： Salman Akram ,  Larry Kinsman

IPC分类号： H01L23/498 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/49827 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/85399 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/181

摘要： An embodiment of an inventive semiconductor device comprises an unpackaged semiconductor wafer section having a major surface with a plurality of bond pads thereon. A plurality of conductors each comprise a lead member and at least a portion formed within a matrix. The conductors are attached to the major surface of the wafer section. An electrical connection electrically couples each of the bond pads with at least one of the lead members. Sealing material is then formed to contact at least the bond pads and the lead members.

公开(公告)号：US20070148918A1

公开(公告)日：2007-06-28

申请号：US11711420

申请日：2007-02-26

申请人： Larry Kinsman ,  Salman Akram

发明人： Larry Kinsman ,  Salman Akram

IPC分类号： H01L21/00

CPC分类号： H01L24/12 ,  H01L21/561 ,  H01L21/563 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/32 ,  H01L24/11 ,  H01L24/28 ,  H01L24/72 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L29/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13116 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/73203 ,  H01L2224/8121 ,  H01L2224/8122 ,  H01L2224/81815 ,  H01L2224/83851 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10157 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1579 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/11 ,  H01L2224/05624

摘要： Channels are formed that pass through an active surface of a semiconductor substrate to provide isolation between adjacent active surface regions defining individual die locations. Bond pads on the substrate are bumped with intermediate conductive elements, after which a material used to encapsulate the active surface is applied, filling the channels and covering exposed peripheral edges of the active surface integrated circuitry. The encapsulant is then planarized to expose the ends of the bumps. External conductive elements such as solder balls are then formed on the exposed bump ends. The semiconductor wafer is diced in alignment with the channels to singulate the semiconductor devices, the encapsulant in the channels keeping the edges of the integrated circuitry substantially hermetically sealed.

公开(公告)号：US20050164429A1

公开(公告)日：2005-07-28

申请号：US11057921

申请日：2005-02-15

申请人： Larry Kinsman ,  Salman Akram

发明人： Larry Kinsman ,  Salman Akram

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L29/06 ,  H01L21/48 ,  H01L21/44 ,  H01L21/50 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/12 ,  H01L21/561 ,  H01L21/563 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/32 ,  H01L24/11 ,  H01L24/28 ,  H01L24/72 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L29/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13116 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/73203 ,  H01L2224/8121 ,  H01L2224/8122 ,  H01L2224/81815 ,  H01L2224/83851 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10157 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1579 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/11 ,  H01L2224/05624

摘要： Channels are formed that pass through an active surface of a semiconductor substrate to provide isolation between adjacent active surface regions defining individual die locations. Bond pads on the substrate are bumped with intermediate conductive elements, after which a material used to encapsulate the active surface is applied, filling the channels and covering exposed peripheral edges of the active surface integrated circuitry. The encapsulant is then planarized to expose the ends of the bumps. External conductive elements such as solder balls are then formed on the exposed bump ends. The semiconductor wafer is diced in alignment with the channels to singulate the semiconductor devices, the encapsulant in the channels keeping the edges of the integrated circuitry substantially hermetically sealed.

公开(公告)号：US06493229B2

公开(公告)日：2002-12-10

申请号：US10132043

申请日：2002-04-25

申请人： Salman Akram ,  Larry Kinsman

发明人： Salman Akram ,  Larry Kinsman

IPC分类号： H05K720

CPC分类号： H01L24/97 ,  H01L23/3121 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： The present invention relates to enhanced thermal management of a microelectronic device package on a printed circuit board (PCB) having a solder ring or dam that encompasses a ball array. The ring or dam bears stress from disparate coefficients of mechanical expansion between the PCB and the ball array.

公开(公告)号：US06669738B2

公开(公告)日：2003-12-30

申请号：US10322119

申请日：2002-12-16

申请人： Salman Akram ,  Larry Kinsman

发明人： Salman Akram ,  Larry Kinsman

IPC分类号： H01L2150

CPC分类号： H01L23/49827 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2924/00012

摘要： An embodiment of an inventive semiconductor device comprises an unpackaged semiconductor wafer section having a major surface with a plurality of bond pads thereon. A plurality of conductors each comprise a lead member and at least a portion formed within a matrix. The conductors are attached to the major surface of the wafer section. An electrical connection electrically couples each of the bond pads with at least one of the lead members. Sealing material is then formed to contact at least the bond pads and the lead members.

公开(公告)号：US06534339B2

公开(公告)日：2003-03-18

申请号：US09989576

申请日：2001-11-20

申请人： Larry Kinsman ,  Salman Akram

发明人： Larry Kinsman ,  Salman Akram

IPC分类号： H01L2144

CPC分类号： H01L23/32 ,  H01L2924/0002 ,  H05K7/02 ,  H05K7/023 ,  H01L2924/00

摘要： An electronic device such as a semiconductor module comprises a printed circuit board and a socket attached to the printed circuit board and in electrical communication therewith. The socket comprises a plurality of electrically-conductive surfaces. The device further comprises a plurality of die and a plurality of supports each attached to the socket. At least one die is mechanically connected with each support, and each die has a plurality of electrically-conductive pads thereon. The plurality of electrically-conductive pads contact the electrically-conductive surfaces of the socket. A method for forming the electronic device is also described.

摘要翻译： 诸如半导体模块的电子设备包括印刷电路板和附接到印刷电路板并与其电连通的插座。 插座包括多个导电表面。 该装置还包括多个模具和多个支撑件，每个支撑件都附接到插座。 至少一个管芯与每个支撑件机械连接，并且每个管芯在其上具有多个导电焊盘。 多个导电垫与插座的导电表面接触。 还描述了用于形成电子设备的方法。

公开(公告)号：US06495400B1

公开(公告)日：2002-12-17

申请号：US09655034

申请日：2000-09-05

申请人： Salman Akram ,  Larry Kinsman

发明人： Salman Akram ,  Larry Kinsman

IPC分类号： H01L2150

CPC分类号： H01L23/49827 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2924/00012

摘要： An embodiment of an inventive semiconductor device comprises an unpackaged semiconductor wafer section having a major surface with a plurality of bond pads thereon. A plurality of conductors each comprise a lead member and at least a portion formed within a matrix. The conductors are attached to the major surface of the wafer section. An electrical connection electrically couples each of the bond pads with at least one of the lead members. Sealing material is then formed to contact at least the bond pads and the lead members.

摘要翻译： 本发明的半导体器件的一个实施例包括一个未封装的半导体晶片部分，其具有在其上的多个接合焊盘的主表面。 多个导体各自包括引线构件和形成在矩阵内的至少一部分。 导体连接到晶片部分的主表面。 电连接将每个接合焊盘与至少一个引线构件电耦合。 然后形成密封材料以至少与接合焊盘和引线部件接触。