发明授权
US6123800A Method and apparatus for handling element on an adhesive film 有权
在粘合膜上处理元件的方法和装置

Method and apparatus for handling element on an adhesive film
摘要:
A system for handling semiconductor and electronic elements secured to an adhesive surface is provided. According to one aspect of the invention, a vacuum is applied through holes in a loading base. Under the influence of the vacuum, the adhesive film is pulled down toward the loading base and stretched around a pick rod so that the adhesive film is peeled away from the element. Thus, adhesive contact between the film and the element is reduced and a vacuum pick or collet is able to lift the element from the adhesive film with minimal force applied to the surface of the element.
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