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公开(公告)号：US6123800A
公开(公告)日：2000-09-26
申请号：US128662
申请日：1998-08-04
IPC分类号： H01L21/00 , H01L21/301 , H01L21/683 , B32B31/18
CPC分类号： H01L21/67132 , H01L21/6838 , Y10S156/943 , Y10T156/1132 , Y10T156/1983
摘要： A system for handling semiconductor and electronic elements secured to an adhesive surface is provided. According to one aspect of the invention, a vacuum is applied through holes in a loading base. Under the influence of the vacuum, the adhesive film is pulled down toward the loading base and stretched around a pick rod so that the adhesive film is peeled away from the element. Thus, adhesive contact between the film and the element is reduced and a vacuum pick or collet is able to lift the element from the adhesive film with minimal force applied to the surface of the element.
摘要翻译： 提供一种用于处理固定到粘合剂表面的半导体和电子元件的系统。 根据本发明的一个方面，通过加载基座中的孔施加真空。 在真空的影响下，将粘合剂膜向着装载基座拉下，并在镐杆周围拉伸，使得粘合剂膜从该元件剥离。 因此，膜和元件之间的粘合剂接触被减小，并且真空接头或夹头能够以最小的力施加到元件的表面上从粘合剂膜提升元件。
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2.发明授权Method and apparatus for retaining and releasing laser bars during a facet coating operation 失效在小面涂布操作期间保持和释放激光棒的方法和装置
公开(公告)号：US5989932A
公开(公告)日：1999-11-23
申请号：US123520
申请日：1998-07-28
CPC分类号： H01S5/028 , H01S5/0201
摘要： An apparatus and process for retaining laser bars during a facet coating operation and releasing the bars after the conclusion of the facet coating operation. A multitude of spacers are positioned with laser bars therebetween. Each spacer includes an upper and lower fixture blade. The spacers are compressed together, thus sandwiching the laser bars, during the facet coating operation. After release of the compressive force, adhered laser bars are removed by moving one of the fixture blades relative to the other fixture blade. Movement can be along the longitudinal axis of the blades, perpendicular to the longitudinal axis, or rotation about a pivot axis. Further, movement can include elevation of one blade, or an end of one blade, relative to the other blade.
摘要翻译： 在小面涂布操作期间保持激光棒并在小面涂布操作结束之后释放棒的装置和方法。 多个间隔件之间设有激光条。 每个间隔件包括上和下固定刀片。 间隔件在面涂层操作期间被压缩在一起，从而夹住激光棒。 在释放压缩力之后，通过相对于另一固定刀片移动固定刀片中的一个来去除附着的激光棒。 运动可以沿着叶片的纵向轴线，垂直于纵向轴线，或绕枢转轴线旋转。 此外，移动可以包括相对于另一个叶片的一个叶片或一个叶片的端部的升高。
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公开(公告)号：US06204092B1
公开(公告)日：2001-03-20
申请号：US09290421
申请日：1999-04-13
IPC分类号： H01L2144
CPC分类号： H01L21/67132 , H01L2221/68354 , Y10S438/976
摘要： An apparatus and method for transferring a semiconductor die from an adhesive film to an output carrier is disclosed. The adhesive film and associated hoop assembly on which the die are secured are inverted so that die face downward, p-side down, from the film. And an output pack is positioned beneath the die. An ejector pin exerts a force on a side of the adhesive film opposite the side on which the semiconductor die is secured to release the die. A vacuum is provided through a port in the output pack, pulling the released die into the output pack. The transfer occurs in a single step and orients the die p-side down in the output pack, thus eliminating the control arm/vacuum collet assembly and associated handling steps of conventional transfer mechanisms.
摘要翻译： 公开了一种用于将半导体管芯从粘合剂膜转移到输出载体的装置和方法。 模具固定在其上的粘合膜和相关联的箍组件被倒置，使得模具从膜向下，p侧向下。 并且输出组件位于模具下方。 顶针在与固定半导体管芯的一侧相对的粘合膜的一侧上施加力以释放模具。 通过输出包装中的端口提供真空，将释放的模具拉入输出包装。 转移发生在单个步骤中，并将模具p侧定向在输出包装中，从而消除了传统转移机构的控制臂/真空夹头组件和相关的处理步骤。
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公开(公告)号：US6142044A
公开(公告)日：2000-11-07
申请号：US389239
申请日：1999-09-03
CPC分类号： B26D3/166 , Y10T82/10 , Y10T82/16 , Y10T82/16016 , Y10T82/16442
摘要： A system is provided for trimming excess vinyl film from a hoop assembly. The hoop assembly may be used to manufacture semiconductor workpieces. The system uses a pressure applying member applied to the excess film with a bearing surface sufficient to receive such pressure on the opposite side of the excess film. The system may be rotated such that the film is trimmed around the entire hoop assembly at the position of the pressure applying member. The bearing surface may be part of the support for the system or incorporated into the hoops.
摘要翻译： 提供一种用于从箍组件修整过量的乙烯基膜的系统。 箍组件可用于制造半导体工件。 该系统使用施加到多余膜上的压力施加构件，该压力施加构件具有足以在多余膜的相对侧上承受这种压力的支承表面。 系统可以旋转，使得膜在压力施加构件的位置处围绕整个箍组件修剪。 轴承表面可以是系统的支撑件的一部分或结合到箍中。
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公开(公告)号：US6165310A
公开(公告)日：2000-12-26
申请号：US163055
申请日：1998-09-29
IPC分类号： H01L21/00 , H01L21/683 , B32B35/00
CPC分类号： H01L21/67132 , H01L21/6838 , H01L2221/68322 , Y10S156/941 , Y10S438/976 , Y10T29/49824 , Y10T156/11 , Y10T156/1132 , Y10T156/19
摘要： An apparatus and method for demounting parts from the adhesive upper surface of a film has a base with a tool mounted thereon. A portion of the tool has a fluted surface extending above the base upper surface. The film lower surface is positioned above the base with a part on the film overlying and opposite the fluted surface of the tool. A vacuum is supplied through at least one passage in the base to the film lower surface to draw the film around and over the tool flute and force the part to at least partially separate from the film adhesive upper surface. The part that has been separated from the adhesive upper surface of the film is stripped from the film adhesive upper surface such as by applying a vacuum force directly to the part through a collet and moving the collet and base relative to one another.
摘要翻译： 用于从胶粘剂上表面拆卸零件的装置和方法具有安装在其上的工具的底座。 工具的一部分具有在基底上表面上方延伸的槽纹表面。 膜下表面位于基底上方，膜上的一部分覆盖并与工具的凹槽表面相对。 通过基座中的至少一个通道将真空供应到膜下表面，以将膜围绕和移动到工具槽上，并迫使该部分至少部分地与膜粘合剂上表面分离。 已经从膜的粘合剂上表面分离的部分从膜粘合剂上表面剥离，例如通过夹套直接施加真空力到零件上并相对于彼此移动夹头和底座。
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6.发明授权公开(公告)号：US06384612B2
公开(公告)日：2002-05-07
申请号：US09168035
申请日：1998-10-07
IPC分类号： G01R104
CPC分类号： G01J1/04 , G01J1/0422 , G01J2001/4247 , G01R31/2635
摘要： A method for testing the light emitted by a group of semiconductor light emitting devices arranged to emit light over a testing area, each light emitting device having a p-contact, the method including connecting a plurality of selectively connectable p-contact probes to the p-contacts of respective light emitting devices in the group of light emitting devices, selectively activating one of the light emitting devices in the group of light emitting devices to emit light over the testing area by selectively supplying a predetermined electrical current to the p-contact of the selected light emitting device via its respective p-contact probe, guiding the light emitted by the selected light emitting device via a light funnel having a collection end and a detection end, the collection end being in juxtaposition with all the light emitting devices in the group of light emitting devices, and detecting light exiting the detection end of the light funnel.
摘要翻译： 一种用于测试被布置成在测试区域上发光的一组半导体发光器件发射的光的方法，每个发光器件具有p型接触，所述方法包括将多个可选择连接的p型接触探针连接到p - 各组发光器件中的各个发光器件的接触，选择性地激活该组发光器件中的一个发光器件以在测试区域上发光，通过选择性地将预定的电流提供给 所选择的发光器件经由其相应的p型接触探针，经由具有收集端和检测端的光漏斗引导由所选择的发光器件发射的光，所述收集端与所述发光器件中的所有发光器件并置 一组发光器件，以及检测从漏斗的检测端射出的光。
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公开(公告)号：US06185816B1
公开(公告)日：2001-02-13
申请号：US09348656
申请日：1999-07-06
IPC分类号： H05K330
CPC分类号： H01L21/681 , Y10T29/4913 , Y10T29/49131 , Y10T29/53178 , Y10T29/53191
摘要： A system for handling semiconductor workpieces, by aligning a movable pick and place device and a movable optical control device, is disclosed. The system and method provide for the formation of an imprint by the pick and place device. The optical control device can then be aligned to that imprint, creating alignment between the pick and place device and the optical control device. Once alignment is complete the imprinted material may be replaced with one or more semiconductor workpieces. The system provides precise, repeatable alignment between the pickup point for the pick and place device and the optical control device.
摘要翻译： 公开了一种通过对准可移动拾取和放置装置和可移动光学控制装置来处理半导体工件的系统。 该系统和方法提供了拾取和放置装置形成印记。 光学控制装置然后可以与该印记对准，从而产生拾取和放置装置与光学控制装置之间的对准。 一旦对准完成，印刷材料可以被一个或多个半导体工件代替。 该系统在拾取和放置装置的拾取点和光学控制装置之间提供精确的，可重复的对准。
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公开(公告)号：US07016382B2
公开(公告)日：2006-03-21
申请号：US09931188
申请日：2001-08-17
IPC分类号： H01S3/13
CPC分类号： H01S5/0687 , H01S3/1305 , H01S3/131 , H01S5/0617 , H01S5/125
摘要： Laser wavelength stabilization is achieved by locating a low selectivity reference filter in a reference path of a laser beam. The low selectivity reference filter, with a periodicity greater than the control filter, is used together with a lookup table for the reference filter to resolve the uncertainty associated with the multivalued control filter. After the wavelength uncertainty for the control filter is resolved, the laser beam is stabilized based on the response of the control filter, as if the reference filter was not present.
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公开(公告)号：US06512291B2
公开(公告)日：2003-01-28
申请号：US09790811
申请日：2001-02-23
IPC分类号： H01L2310
CPC分类号： H01L35/34 , H01L23/38 , H01L23/4985 , H01L35/08 , H01L2224/16 , H01L2924/01046 , H01L2924/01079 , H01L2924/12044 , Y10S257/93
摘要： A method and apparatus are disclosed for supporting semiconductor devices on a flexible support which includes one or more thermoelectric cooling devices. The thermoelectric cooling devices, which include at least one pair of positively-doped and negatively-doped elements electrically coupled together, are positioned between a pair of flex panels. Each panel has connector sites at which connectors such as solder balls are located. The thermoelectric cooling devices may be arranged between the panels to create two or more device support areas having different temperature regimes. The thermoelectric cooling devices may be connected to the panels by placing the panels, connectors and thermoelectric cooling devices in a reflow chamber, exposing them to a reducing atmosphere, and heating to a temperature sufficient to reflow the connectors.
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10.发明授权Method for interconnecting semiconductor elements to form a thermoelectric cooler and a thermoelectric cooler formed therefrom 有权用于互连半导体元件以形成热电冷却器和由其形成的热电冷却器的方法公开(公告)号：US06555413B1
公开(公告)日：2003-04-29
申请号：US09790810
申请日：2001-02-23
IPC分类号： H01L2144
摘要： A method for electrically coupling thermoelectric cooling (TEC) elements together is described. The TEC elements are encased within an encapsulating material, such as epoxy, and a resist layer is laid on either end of the encapsulating material, covering the ends of the TEC elements. The resist layers are selectively developed to open locations in the resist layers in between adjacent elements. Conductive material, such as gold, is sputter deposited into the locations to provide electrical coupling of the elements.
摘要翻译： 描述了将热电冷却（TEC）元件电耦合在一起的方法。 TEC元件封装在诸如环氧树脂的封装材料中，并且将抗蚀剂层铺设在封装材料的任一端上，覆盖TEC元件的端部。 选择性地显影抗蚀剂层以在相邻元件之间的抗蚀剂层中打开位置。 诸如金的导电材料被溅射沉积到这些位置以提供元件的电耦合。
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