发明授权
- 专利标题： Integrated circuit chip package and method of making the same
- 专利标题（中）： 集成电路芯片封装及其制作方法
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申请号： US984547申请日： 1997-12-03
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公开(公告)号： US6124546A公开(公告)日： 2000-09-26
- 发明人: James Hayward , Quang Nguyen
- 申请人： James Hayward , Quang Nguyen
- 申请人地址： CA Sunnyvale
- 专利权人： Advanced Micro Devices, Inc.
- 当前专利权人： Advanced Micro Devices, Inc.
- 当前专利权人地址： CA Sunnyvale
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L23/498 ; H01L23/28
摘要：
A semiconductor integrated circuit chip package includes top and bottom interposers 2 and 4, a semiconductor die 14 attached to the top interposer 2, a wirebond 18 or a flipchip connector 52 connected between the die 14 and the top interposer 2, and a tab bond 22 providing an electrical connection from the wirebond 18 or the flipchip connector 52 to outside the bottom interposer 4. A method of making the chip package includes providing top and bottom interposers 2 and 4, attaching a semiconductor die 14 to the top interposer 2, providing a wirebond 18 or a flipchip connector 52 between the die 14 and the top interposer 2, providing a tab bond 22 between the top and bottom interposers 2 and 4, and providing an encapsulant 16 to fill the intermediate volume 40 between the top and bottom interposers 2 and 4.
公开/授权文献
- US5265335A Forming method of bushing with inner sliding surface 公开/授权日：1993-11-30
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