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    Method of integrated circuit packaging
    4.
    发明授权
    Method of integrated circuit packaging 有权
    集成电路封装方法

    公开(公告)号：US07513035B2

    公开(公告)日：2009-04-07

    申请号：US11422807

    申请日：2006-06-07

    Applicant: Seah Sun Too ,  Mohammad Khan ,  James Hayward ,  Jacquana Diep

    Inventor： Seah Sun Too ,  Mohammad Khan ,  James Hayward ,  Jacquana Diep

    IPC: H05K3/30 ,  H05K3/34

    CPC classification number: H01L23/3675 ,  H01L23/10 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16152 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144

    Abstract: Various integrated circuit package elements are provided. In one aspect, an integrated circuit package device is provided that includes a lid for covering an integrated circuit. The lid has a convex surface for applying pressure on the integrated circuit when the lid is placed in a selected position. In another aspect, an integrated circuit package device is provided that includes a lid that has a surface for applying pressure to an integrated circuit when the lid is in a selected position. A gold film is coupled to the surface. The gold film has a periphery and a plurality of rounds extending from the periphery.

    Abstract translation: 提供各种集成电路封装元件。 一方面，提供一种集成电路封装装置，其包括用于覆盖集成电路的盖。 当盖被置于选定位置时，该盖具有用于在集成电路上施加压力的凸面。 在另一方面，提供一种集成电路封装装置，其包括盖，该盖具有当盖处于选定位置时向集成电路施加压力的表面。 金膜耦合到表面。 金膜具有从周边延伸的周边和多个圆。

    Integrated Circuit Packaging
    5.
    发明申请
    Integrated Circuit Packaging 有权
    集成电路封装

    公开(公告)号：US20070284144A1

    公开(公告)日：2007-12-13

    申请号：US11422807

    申请日：2006-06-07

    Applicant: Seah Sun Too ,  Mohammad Khan ,  James Hayward ,  Jacquana Diep

    Inventor： Seah Sun Too ,  Mohammad Khan ,  James Hayward ,  Jacquana Diep

    IPC: H01R13/46

    CPC classification number: H01L23/3675 ,  H01L23/10 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16152 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144

    Abstract: Various integrated circuit package elements are provided. In one aspect, an integrated circuit package device is provided that includes a lid for covering an integrated circuit. The lid has a convex surface for applying pressure on the integrated circuit when the lid is placed in a selected position. In another aspect, an integrated circuit package device is provided that includes a lid that has a surface for applying pressure to an integrated circuit when the lid is in a selected position. A gold film is coupled to the surface. The gold film has a periphery and a plurality of rounds extending from the periphery.

    Abstract translation: 提供各种集成电路封装元件。 一方面，提供一种集成电路封装装置，其包括用于覆盖集成电路的盖。 当盖被置于选定位置时，该盖具有用于在集成电路上施加压力的凸面。 在另一方面，提供一种集成电路封装装置，其包括盖，该盖具有当盖处于选定位置时向集成电路施加压力的表面。 金膜耦合到表面。 金膜具有从周边延伸的周边和多个圆。

    Sunscreen composition with enhanced SPF and water resistant properties
    6.
    发明申请
    Sunscreen composition with enhanced SPF and water resistant properties 有权
    具有增强SPF和防水性能的防晒组合物

    公开(公告)号：US20050186160A1

    公开(公告)日：2005-08-25

    申请号：US11114668

    申请日：2005-04-26

    Applicant: Duncan Aust ,  James Wilmott ,  James Hayward

    Inventor： Duncan Aust ,  James Wilmott ,  James Hayward

    IPC: A61K8/04 ,  A61K8/73 ,  A61Q17/04 ,  A61K7/42

    CPC classification number: A61K8/044 ,  A61K8/73 ,  A61K2800/413 ,  A61Q17/04 ,  B82Y5/00

    Abstract: The present invention relates to a sunscreen formulation which exhibits superior ultraviolet protection and water resistance than prior art sunscreen compositions. The sunscreen formulation comprises (a) a dispersion comprising a sunscreen active agent and (b) a base composition comprising a rheological modifying agent and water. The sunscreen formulation is substantially free of surfactants. According to a preferred embodiment, the sunscreen active agent is ethylhexylmethoxycinnamate, butylmethoxydibenzoylmethane, or a combination thereof. The sunscreen formulation preferably comprises a phosphorylated starch derivative as a Theological modifying agent. Another embodiment of the present invention is a method of protecting skin or hair from ultraviolet radiation by applying an effective amount of the sunscreen formulation of the present invention to the skin or hair.

    Abstract translation: 本发明涉及与现有技术的防晒组合物相比表现出优异的紫外线防护性和耐水性的防晒制剂。 防晒制剂包含（a）包含防晒活性剂的分散体和（b）包含流变改性剂和水的基础组合物。 防晒制剂基本上不含表面活性剂。 根据优选的实施方案，防晒活性剂是甲氧基肉桂酸乙基己酯，丁基甲氧基二苯甲酰甲烷或其组合。 防晒制剂优选包含作为神学改性剂的磷酸化淀粉衍生物。 本发明的另一个实施方案是通过将有效量的本发明的防晒制剂施用于皮肤或毛发来保护皮肤或头发免受紫外线辐射的方法。

    Automotive running board
    9.
    发明授权
    Automotive running board 失效
    汽车运行板

    公开(公告)号：US6050579A

    公开(公告)日：2000-04-18

    申请号：US063591

    申请日：1998-04-21

    Applicant: Arthur E. Selland ,  Thomas G. Pfotenhauer ,  Mark L. Thompson ,  James Hayward

    Inventor： Arthur E. Selland ,  Thomas G. Pfotenhauer ,  Mark L. Thompson ,  James Hayward

    IPC: B29C44/18 ,  B60R3/00

    CPC classification number: B29C44/18 ,  B60R3/002

    Abstract: The running board of the present invention provide the structural integrity to withstand the static and dynamic loads to which articles of this type are normally subjected. The design of the running board in terms of its configuration, the components making up the running board, namely, the blow molded exterior shell and the foam core, have specific structural characteristics. For example, the foam core has a density in the range of 100 kg/m.sup.3 to 150 kg/m.sup.3 and has sufficient resiliency to permit the part to return to substantially its original shape following removal of a load of predetermined magnitude.

    Abstract translation: 本发明的跑步板提供了结构完整性，以承受这种类型的物品通常受到的静态和动态载荷。 运行板的构造方面，构成运行板的部件，即吹塑外壳和泡沫芯的构造具有特定的结构特征。 例如，泡沫芯具有在100kg / m 3至150kg / m 3范围内的密度，并且具有足够的弹性，以在去除预定量级的载荷之后使部件恢复到其基本上其原始形状。

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