Invention Grant
- Patent Title: Copper and steel components for use in manufacturing printed circuit boards
- Patent Title (中): 用于制造印刷电路板的铜和钢组件
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Application No.: US210349Application Date: 1998-12-11
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Publication No.: US6130000APublication Date: 2000-10-10
- Inventor: Mark S. Frater
- Applicant: Mark S. Frater
- Applicant Address: CA Lodi
- Assignee: R. E. Service Company, Inc.
- Current Assignee: R. E. Service Company, Inc.
- Current Assignee Address: CA Lodi
- Main IPC: H05K3/02
- IPC: H05K3/02 ; B32B33/00
Abstract:
A corrosion resistant sheet alloy separator sheet for use in a press lay-up between printed circuit board panels.
Public/Granted literature
- US5527619A Tannin stain blocking coated substrate Public/Granted day:1996-06-18
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