发明授权
- 专利标题： High speed method of aligning cutting lines of a workpiece using patterns
- 专利标题（中）： 使用图案调整工件切割线的高速方法
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申请号： US199198申请日： 1998-11-25
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公开(公告)号： US6142138A公开(公告)日： 2000-11-07
- 发明人: Masayuki Azuma , Hirofumi Shimoda
- 申请人： Masayuki Azuma , Hirofumi Shimoda
- 申请人地址： JPX Tokyo DE Wilmington
- 专利权人： Tokyo Seimitsu Co., Ltd.,Kulicke & Soffa Investments, Inc.
- 当前专利权人： Tokyo Seimitsu Co., Ltd.,Kulicke & Soffa Investments, Inc.
- 当前专利权人地址： JPX Tokyo DE Wilmington
- 优先权： JPX9-330540 19971201
- 主分类号： H01L21/68
- IPC分类号： H01L21/68 ; B23D59/00 ; B27B31/06 ; B28D5/02 ; H01L21/301 ; B28D1/04
摘要：
Two imaging equipment are provided at a pair of cutting blade units, and the two imaging equipment image patterns at first positions in proximity to the center of a wafer at the same time. A controller drives drive mechanisms to align the wafer in such a way that current image patterns at the first positions can match with a reference pattern at the first positions. Then, the two imaging equipment are moved to positions for imaging patterns at second positions at the outer circumference of the wafer to image the patterns at the second positions. The controller drives the drive mechanisms to align the wafer in such a way that current image patterns at the second positions can match with a reference pattern at the second positions.
公开/授权文献
- US5480381A Needle-less injector 公开/授权日：1996-01-02
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