公开(公告)号：US6142138A

公开(公告)日：2000-11-07

申请号：US199198

申请日：1998-11-25

申请人： Masayuki Azuma ,  Hirofumi Shimoda

发明人： Masayuki Azuma ,  Hirofumi Shimoda

IPC分类号： H01L21/68 ,  B23D59/00 ,  B27B31/06 ,  B28D5/02 ,  H01L21/301 ,  B28D1/04

CPC分类号： B27B31/06 ,  B23D59/002 ,  B28D5/029 ,  Y10T83/6587 ,  Y10T83/7697

摘要： Two imaging equipment are provided at a pair of cutting blade units, and the two imaging equipment image patterns at first positions in proximity to the center of a wafer at the same time. A controller drives drive mechanisms to align the wafer in such a way that current image patterns at the first positions can match with a reference pattern at the first positions. Then, the two imaging equipment are moved to positions for imaging patterns at second positions at the outer circumference of the wafer to image the patterns at the second positions. The controller drives the drive mechanisms to align the wafer in such a way that current image patterns at the second positions can match with a reference pattern at the second positions.

摘要翻译： 两个成像设备设置在一对切割刀片单元处，并且两个成像设备图像图案同时在第一位置处于晶片中心附近。 控制器驱动驱动机构以使得第一位置处的当前图像图案与第一位置处的参考图案匹配的方式对齐晶片。 然后，将两个成像设备移动到用于在晶片的外周的第二位置处成像图案的位置，以在第二位置成像图案。 控制器驱动驱动机构以使得第二位置处的当前图像图案与第二位置处的参考图案匹配的方式对齐晶片。

公开(公告)号：USRE39018E1

公开(公告)日：2006-03-21

申请号：US10053377

申请日：2002-01-23

申请人： Masayuki Azuma ,  Hirofumi Shimoda ,  Mani Fischer

发明人： Masayuki Azuma ,  Hirofumi Shimoda ,  Mani Fischer

IPC分类号： B28D1/04

CPC分类号： B27B31/06 ,  B23D59/002 ,  B28D5/029 ,  Y10T83/6587 ,  Y10T83/7697

摘要： Two imaging equipment are provided at a pair of cutting blade units, and the two imaging equipment image patterns at first positions in proximity to the center of a wafer at the same time. A controller drives drive mechanisms to align the wafer in such a way that current image patterns at the first positions can match with a reference pattern at the first positions. Then, the two imaging equipment are moved to positions for imaging patterns at second positions at the outer circumference of the wafer to image the patterns at the second positions. The controller drives the drive mecha- nisms to align the wafer in such a way that current image patterns at the second positions can match with a reference pattern at the second positions.

摘要翻译： 两个成像设备设置在一对切割刀片单元处，并且两个成像设备图像图案同时在第一位置处于晶片中心附近。 控制器驱动驱动机构以使得第一位置处的当前图像图案与第一位置处的参考图案匹配的方式对准晶片。 然后，将两个成像设备移动到用于在晶片的外周的第二位置处成像图案的位置，以在第二位置成像图案。 控制器驱动驱动机构以使晶片对准，使得第二位置处的当前图像图案可以与第二位置处的参考图案匹配。

公开(公告)号：US5885051A

公开(公告)日：1999-03-23

申请号：US908940

申请日：1997-08-08

申请人： Masayuki Azuma ,  Hirofumi Shimoda

发明人： Masayuki Azuma ,  Hirofumi Shimoda

IPC分类号： B23Q7/04 ,  B28D5/00 ,  B65G49/07 ,  H01L21/301 ,  H01L21/677

CPC分类号： B28D5/0082 ,  Y10S414/141 ,  Y10T83/2187

摘要： A wafer is gripped by a chuck part provided at a front end of a slide arm, and the slide arm is moved in the first direction from a reference position, from which the workpiece is transferred to a workpiece cutting part, to a cleansing position, where the cut workpiece is cleansed, so that the wafer can be transferred in the first direction. The wafer is gripped by a chuck part provided at a front end of a rotary arm, which is rotatably supported at a base end by the front end of the slide arm. Then, the slide arm is moved in the first direction and the rotary arm is rotated. Thereby, the wafer can be transferred in the second direction, which is perpendicular to the first direction.

摘要翻译： 通过设置在滑动臂的前端的卡盘部夹持晶片，并且使滑动臂从第一方向从工件移动到工件切削部的基准位置移动到清洁位置， 其中切割的工件被清洁，使得晶片可以沿第一方向传送。 晶片被设置在旋转臂的前端的卡盘部分夹持，旋转臂的前端由滑动臂的前端可旋转地支撑在基端。 然后，滑动臂沿第一方向移动，旋转臂旋转。 由此，可以沿与第一方向垂直的第二方向转印晶片。

公开(公告)号：US06354912B1

公开(公告)日：2002-03-12

申请号：US09203611

申请日：1998-12-02

申请人： Masateru Osada ,  Masayuki Azuma ,  Hirofumi Shimoda ,  Felix Cohen

发明人： Masateru Osada ,  Masayuki Azuma ,  Hirofumi Shimoda ,  Felix Cohen

IPC分类号： B28D104

CPC分类号： B28D5/029 ,  B28D5/023

摘要： Two blades are arranged oppositely at a predetermined interval along the Y-axis. The two blades cut a wafer along two cutting lines at the same time while the two blades are moving along the X-axis. After the wafer is cut along these two cutting lines, the two blades are moved along the Y-axis by one pitch of the cutting lines so that the wafer can be cut along the next two cutting lines. This action is repeated to cut the wafer along the cutting lines continuously. This wafer cutting method can hold the movement of the blades along the X-axis to a minimum because of the oppositely-arranged two blades. Consequently, the wafer can be cut in a short period of time.

摘要翻译： 两个叶片沿着Y轴以预定的间隔相对布置。 两个刀片同时沿着两条切割线切割晶片，同时两个刀片沿X轴移动。 在沿着这两条切割线切割晶片之后，两个刀片沿着Y轴移动一个切割线的间距，使得可以沿着接下来的两条切割线切割晶片。 重复该操作以连续切割切割线上的晶片。 这种晶片切割方法可以将刀片沿着X轴移动到最小限度，因为相对布置的两个刀片。 因此，可以在短时间内切割晶片。

公开(公告)号：US06743076B2

公开(公告)日：2004-06-01

申请号：US10143827

申请日：2002-05-14

申请人： Tadashi Adachi ,  Masayuki Azuma ,  Takayuki Kaneko

发明人： Tadashi Adachi ,  Masayuki Azuma ,  Takayuki Kaneko

IPC分类号： B24B4900

CPC分类号： B23D59/001 ,  B23D45/027 ,  B28D5/0076 ,  B28D5/024

摘要： The flange cover covering the blade is divided into two. The second cover is turnably connected to the first cover through a shaft parallel with the spindle of the blade, and the second cover is opened and closed in connection with vertical movement of the spindle. When the spindle is moved upward for replacing the blade, the second cover is automatically turned to the opening position, and L-shaped coolant jetting nozzles are moved away from positions below the blade to positions beside the blade. Thus, the blade can be easily replaced, and an automatic blade replacing system can be applied.

摘要翻译： 覆盖刀片的法兰盖分为两部分。 第二盖通过与叶片的主轴平行的轴可转动地连接到第一盖，并且第二盖与主轴的垂直运动相关地打开和关闭。 当主轴向上移动以更换刀片时，第二盖自动转到打开位置，并且L形冷却剂喷射喷嘴移动离开刀片下方的位置以位于刀片旁边。 因此，可以容易地更换刀片，并且可以应用自动刀片更换系统。

公开(公告)号：US06732612B2

公开(公告)日：2004-05-11

申请号：US09748242

申请日：2000-12-27

申请人： Tadashi Adachi ,  Masayuki Azuma

发明人： Tadashi Adachi ,  Masayuki Azuma

IPC分类号： B26D114

CPC分类号： B27B5/32 ,  B25B13/48 ,  B28D5/0058 ,  Y10T83/04 ,  Y10T83/7747 ,  Y10T83/9379 ,  Y10T83/9464

摘要： With a blade exchanging device, a cylindrical body is engaged with a nut that is fastened to a spindle, and at the same time the nut is held by fitting nails of a chuck member with grooves that are formed on the nut. Next, a torque wrench is inserted through the cylindrical body, and a polygonal head of the torque wrench is engaged with a polygonal hole formed in the head of the spindle. In this state, the spindle is rotated with the torque wrench in a direction to unfasten the nut from the spindle. The nut is thereby detached from the spindle. When the cylindrical body is disengaged from the spindle, the nut is prevented from falling off the cylindrical body, since the nails of the chuck hold the nut.

摘要翻译： 利用叶片更换装置，圆筒体与固定在心轴上的螺母啮合，同时通过将螺母固定在具有形成在螺母上的凹槽的卡盘构件的钉子上。 接下来，通过圆筒体插入扭矩扳手，并且扭矩扳手的多边形头部与形成在心轴的头部中的多边形孔接合。 在这种状态下，主轴与扭矩扳手一起旋转，使螺母从主轴松开。 因此螺母从主轴分离。 当圆柱体与心轴分离时，由于卡盘的指甲夹住螺母，所以可以防止螺母脱离圆柱体。

公开(公告)号：US08724122B2

公开(公告)日：2014-05-13

申请号：US13581228

申请日：2011-02-22

申请人： Hironari Adachi ,  Naohiro Kubo ,  Masayuki Azuma ,  Masahiro Nishio ,  Masaki Tanzawa

发明人： Hironari Adachi ,  Naohiro Kubo ,  Masayuki Azuma ,  Masahiro Nishio ,  Masaki Tanzawa

IPC分类号： G01B11/28

CPC分类号： B23K3/08 ,  B23K31/125 ,  G01B11/25

摘要： A bead inspection step and a bead inspection apparatus that inspect the quality of a bead are disclosed . . . . The bead inspection apparatus includes a wire-feed-speed measurement device that measures the feed speed of a brazing wire, and an analysis portion that measures and analyzes position coordinate data about surfaces of a first, workpiece, a second workpiece and the bead, and performs a first shape data measurement step of. measuring first shape data before brazing, a second shape data measurement step of measuring second shape data after the brazing, a feature quantity calculation step of calculating predicted values of feature quantities based on the first and second shape data and the brazing wire feed speed, and a throat thickness calculation step of calculating a predicted value of the throat thickness by a regression expression formed based on actual measurements of the feature quantities and of the throat thickness.

摘要翻译： 公开了一种检查胎圈质量的胎圈检查步骤和胎圈检查装置。 。 。 。 珠检查装置包括测量钎焊丝的进给速度的送丝速度测量装置和测量和分析关于第一工件，第二工件和胎圈的表面的位置坐标数据的分析部分，以及 执行第一形状数据测量步骤。 在钎焊之前测量第一形状数据，第二形状数据测量步骤，在钎焊之后测量第二形状数据;特征量计算步骤，基于第一形状数据和第二形状数据和钎焊丝馈送速度计算特征量的预测值，以及 喉部厚度计算步骤，通过基于特征量和喉部厚度的实际测量形成的回归表达式来计算喉部厚度的预测值。

公开(公告)号：US08492676B2

公开(公告)日：2013-07-23

申请号：US10555451

申请日：2004-05-17

申请人： Masayuki Azuma ,  Yasuyuki Sakaya

发明人： Masayuki Azuma ,  Yasuyuki Sakaya

IPC分类号： B23K26/14

CPC分类号： B23K26/04 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  H01L21/67092 ,  H01L21/67253

摘要： There is provided a laser dicing apparatus comprising: a first position detecting device detecting a position of the surface of a wafer at an incident point of laser light; second position detecting device detecting in advance a position of the surface of the wafer; and a control section controlling the position in the thickness direction of a condensing point inside the wafer, wherein the control section, when scanning the laser light from the outside of a periphery of the wafer to the inside of the periphery of the wafer, performs control based on data obtained with the second position detecting device detecting the position of the condensing point at the periphery of the wafer, and after scanning a predetermined distance, switches to perform control based on data obtained by the first position detecting device. Thereby, when the laser light is made incident through the surface of the wafer and scanned, the position control of the condensing point of the laser light can be performed even at the periphery of the wafer, and a modified region by multi-photon absorption can be formed at a predetermined position inside the wafer.

摘要翻译： 提供了一种激光切割装置，包括：第一位置检测装置，其在激光入射点处检测晶片表面的位置; 第二位置检测装置预先检测晶片的表面的位置; 以及控制部，其控制晶片内的聚光点的厚度方向的位置，其中，所述控制部在从所述晶片的周围的外部到所述晶片的周围的内侧扫描所述激光时，进行控制 基于通过第二位置检测装置检测到晶片周围的聚光点的位置而获得的数据，并且在扫描预定距离之后，切换到基于由第一位置检测装置获得的数据进行控制。 因此，当激光通过晶片的表面入射并进行扫描时，即使在晶片的周围也可以执行激光的聚光点的位置控制，并且通过多光子吸收的改质区域 形成在晶片内部的预定位置。

公开(公告)号：US20120314225A1

公开(公告)日：2012-12-13

申请号：US13581228

申请日：2011-02-22

申请人： Hironari Adachi ,  Naohiro Kubo ,  Masayuki Azuma ,  Masahiro Nishio ,  Masaki Tanzawa

发明人： Hironari Adachi ,  Naohiro Kubo ,  Masayuki Azuma ,  Masahiro Nishio ,  Masaki Tanzawa

IPC分类号： G01B11/24

CPC分类号： B23K3/08 ,  B23K31/125 ,  G01B11/25

摘要： A bead inspection step and a bead inspection apparatus that inspect the quality of a bead are disclosed . . . . The bead inspection apparatus includes a wire-feed-speed measurement device that measures the feed speed of a brazing wire, and an analysis portion that measures and analyzes position coordinate data about surfaces of a first, workpiece, a second workpiece and the bead, and performs a first shape data measurement step of. measuring first shape data before brazing, a second shape data measurement step of measuring second shape data after the brazing, a feature quantity calculation step of calculating predicted values of feature quantities based on the first and second shape data and the brazing wire feed speed, and a throat thickness calculation step of calculating a predicted value of the throat thickness by a regression expression formed based on actual measurements of the feature quantities and of the throat thickness.

摘要翻译： 公开了一种检查胎圈质量的胎圈检查步骤和胎圈检查装置。 。 。 。 珠检查装置包括测量钎焊丝的进给速度的送丝速度测量装置和测量和分析关于第一工件，第二工件和胎圈的表面的位置坐标数据的分析部分，以及 执行第一形状数据测量步骤。 在钎焊之前测量第一形状数据，第二形状数据测量步骤，在钎焊之后测量第二形状数据;特征量计算步骤，基于第一形状数据和第二形状数据和钎焊丝馈送速度计算特征量的预测值，以及 喉部厚度计算步骤，通过基于特征量和喉部厚度的实际测量形成的回归表达式来计算喉部厚度的预测值。

公开(公告)号：US09127322B2

公开(公告)日：2015-09-08

申请号：US12797014

申请日：2010-06-09

申请人： Masayuki Azuma ,  Taro Tachibana ,  Shuhei Furukawa ,  Ryoichi Nakajima ,  Hajime Watanabe ,  Sayumi Kobayashi

发明人： Masayuki Azuma ,  Taro Tachibana ,  Shuhei Furukawa ,  Ryoichi Nakajima ,  Hajime Watanabe ,  Sayumi Kobayashi

IPC分类号： C12N1/18 ,  C12R1/865 ,  A21D8/04 ,  A23K1/00 ,  A23K1/18

CPC分类号： C12R1/865 ,  A21D8/047 ,  A23K10/18 ,  A23K50/40 ,  A23K50/42 ,  C12N1/18

摘要： A yeast including a cell wall having a low mannan content, wherein the yeast has an immunopotentiating capability, and is able to grow in a YPD liquid medium with an osmotic pressure of 300 mOsm, and wherein, when a part of a pre-culture of the yeast grown in a YPDS liquid medium is added to the YPD liquid medium so that OD660 is adjusted to 0.1, followed by incubating at 30° C. for 24 hours, the yeast grows to increase the OD660 of the YPD liquid medium to 1.0 or more.

摘要翻译： 一种酵母，其包含具有低甘露聚糖含量的细胞壁，其中所述酵母具有免疫增强能力，并且能够在渗透压为300mOsm的YPD液体培养基中生长，并且其中，当部分预培养物 将YPDS液体培养基中生长的酵母加入到YPD液体培养基中，使OD660调节至0.1，然后在30℃下孵育24小时，酵母生长以将YPD液体培养基的OD660增加至1.0或 更多。