发明授权
US6152818A Flow control apparatus for a semiconductor manufacturing wet bench
有权
用于半导体制造湿式工作台的流量控制装置
- 专利标题： Flow control apparatus for a semiconductor manufacturing wet bench
- 专利标题（中）： 用于半导体制造湿式工作台的流量控制装置
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申请号： US247698申请日： 1999-02-10
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公开(公告)号： US6152818A公开(公告)日： 2000-11-28
- 发明人: Steven D. Jacob , Louis Hrkman, Jr. , Michael Laport
- 申请人： Steven D. Jacob , Louis Hrkman, Jr. , Michael Laport
- 申请人地址： IL Buffalo Grove
- 专利权人： Siemens Building Technologies, Inc.
- 当前专利权人： Siemens Building Technologies, Inc.
- 当前专利权人地址： IL Buffalo Grove
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; B08B15/02
摘要：
Apparatus for controlling the volume of air that is supplied and exhausted from a electronic semiconductor manufacturing wet bench is disclosed. The volume of air that is exhausted from the wet bench is increased during predetermined portions of the manufacturing process and is reduced during noncritical times as a function of predetermined conditions that may be detected or otherwise determined during the manufacturing process.
公开/授权文献
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