Flow control apparatus for a semiconductor manufacturing wet bench
    1.
    发明授权
    Flow control apparatus for a semiconductor manufacturing wet bench 有权
    用于半导体制造湿式工作台的流量控制装置

    公开(公告)号:US6152818A

    公开(公告)日:2000-11-28

    申请号:US247698

    申请日:1999-02-10

    IPC分类号: H01L21/00 B08B15/02

    CPC分类号: H01L21/67017 H01L21/67075

    摘要: Apparatus for controlling the volume of air that is supplied and exhausted from a electronic semiconductor manufacturing wet bench is disclosed. The volume of air that is exhausted from the wet bench is increased during predetermined portions of the manufacturing process and is reduced during noncritical times as a function of predetermined conditions that may be detected or otherwise determined during the manufacturing process.

    摘要翻译: 公开了一种用于控制从电子半导体制造湿式工作台供应和排出的空气体积的装置。 在湿式工作台中排出的空气的体积在制造过程的预定部分期间增加,并且在非临界时间期间作为在制造过程中可被检测或以其它方式确定的预定条件的函数而减小。