发明授权
- 专利标题： Recessed flip-chip package
- 专利标题（中）： 嵌入式倒装芯片封装
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申请号： US120148申请日： 1998-07-21
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公开(公告)号： US6154370A公开(公告)日： 2000-11-28
- 发明人: Yinon Degani , Robert Charles Frye , Yee Leng Low
- 申请人： Yinon Degani , Robert Charles Frye , Yee Leng Low
- 申请人地址： NJ Murray Hill
- 专利权人： Lucent Technologies Inc.
- 当前专利权人： Lucent Technologies Inc.
- 当前专利权人地址： NJ Murray Hill
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L23/498 ; H01L23/50 ; H05K1/18
摘要：
The specification describes a recessed chip IC package in which the cavity in the printed wiring board into which the IC chip is recessed is used as a through hole interconnection, thus increasing the interconnection density. If the through cavity interconnections are used as power and ground the signal I/O pads and the signal runners are effectively isolated.
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