发明授权
- 专利标题： Ion plating apparatus
- 专利标题（中）： 离子镀装置
-
申请号： US269737申请日： 1999-06-28
-
公开(公告)号： US6160350A公开(公告)日： 2000-12-12
- 发明人: Toshiyuki Sakemi , Masaru Tanaka
- 申请人： Toshiyuki Sakemi , Masaru Tanaka
- 申请人地址： JPX Tokyo
- 专利权人： Sumitomo Heavy Industries, Ltd.
- 当前专利权人： Sumitomo Heavy Industries, Ltd.
- 当前专利权人地址： JPX Tokyo
- 主分类号： C23C14/32
- IPC分类号： C23C14/32 ; H01J37/32 ; H01J7/24 ; H05B31/26
摘要：
Around hearths 30a and 30b placed inside a vacuum chamber 11, auxiliary hearths 31a and 31b with annular permanent magnets included therein are arranged. Orientations of magnetic poles of annular permanent magnets 21a and 21b provided in two adjacent plasma guns 1A and 2B, orientations of magnetic poles of two adjacent electromagnetic coils 22a and 22b, orientations of two adjacent steering coils 24a and 24b, and orientations of magnetic poles of the two adjacent annular permanent magnets included in the two hearths are reversed from each other.
公开/授权文献
- US5520205A Apparatus for wafer cleaning with rotation 公开/授权日：1996-05-28
信息查询
IPC分类:
