发明授权
US6166322A Encapulation process for mono-and polycrystalline silicon solar cell
modules
有权
单晶硅和多晶硅太阳能电池模块的封装工艺
- 专利标题: Encapulation process for mono-and polycrystalline silicon solar cell modules
- 专利标题(中): 单晶硅和多晶硅太阳能电池模块的封装工艺
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申请号: US292873申请日: 1999-04-16
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公开(公告)号: US6166322A公开(公告)日: 2000-12-26
- 发明人: Chih-Chiang Chen , Jing-Pin Pan
- 申请人: Chih-Chiang Chen , Jing-Pin Pan
- 申请人地址: TWX Hsinchu
- 专利权人: Industrial Technology Research Institute
- 当前专利权人: Industrial Technology Research Institute
- 当前专利权人地址: TWX Hsinchu
- 主分类号: H01L31/048
- IPC分类号: H01L31/048 ; H01L31/05
摘要:
A crystalline silicon based solar cell module comprising: (a) a crystalline silicon based solar cell array formed by interconnecting a plurality of crystalline silicon based solar cells with an interconnect; (b) a hot melt adhesive applied above and below the interconnect to reduce mechanical and thermal stress between the interconnect and the crystalline silicon based solar cells. The hot melt adhesive can be an ethylene-polymer along with a variety of additives such as oxidation inhibitor, UV stabilizer, and UV absorber.
公开/授权文献
- US5472774A Photolithography test structure 公开/授权日:1995-12-05
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