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发明授权
US06169316A Semiconductor pressure sensor including sensor chip fixed to package by adhesive 失效
半导体压力传感器包括通过粘合剂固定到包装上的传感器芯片

  • 专利标题： Semiconductor pressure sensor including sensor chip fixed to package by adhesive
  • 专利标题（中）： 半导体压力传感器包括通过粘合剂固定到包装上的传感器芯片
  • 申请号： US09287012
    申请日： 1999-04-06
  • 公开(公告)号： US06169316A
    公开(公告)日： 2001-01-02
  • 发明人: Minekazu Sakai , Yasutoshi Suzuki
  • 申请人： Minekazu Sakai , Yasutoshi Suzuki
  • 优先权： JP10-093260 19980406
  • 主分类号： H01L2982
  • IPC分类号： H01L2982
Semiconductor pressure sensor including sensor chip fixed to package by adhesive
摘要：
In a semiconductor pressure sensor, adhesive having a Young's modulus of equal to or less than 1×104 Pa such as silicone system gel is disposed between a bottom wall of a casing and a bottom wall of a sensor chip, and a space between side walls of the sensor chip and side walls of the casing is filled with adhesive having a Young's modulus of equal to or larger than 1×104 Pa, such as silicone system adhesive or epoxy system adhesive. Accordingly, temperature characteristics of the sensor chip can be improved without causing pressure leakage.
摘要（中）：

在半导体压力传感器中，在壳体的底壁和传感器芯片的底壁之间设置有等于或小于1×10 4 Pa的杨氏模量的粘合剂，例如硅酮体系凝胶，并且在侧壁之间的空间 传感器芯片和壳体的侧壁填充有杨氏模量等于或大于1×10 4 Pa的粘合剂，例如硅氧烷系粘合剂或环氧树脂体系粘合剂。 因此，可以提高传感器芯片的温度特性，而不会引起压力泄漏。

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