发明授权
- 专利标题： Apparatus for removing slurry particles
- 专利标题（中）： 用于除去浆料颗粒的装置
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申请号： US09004525申请日： 1998-01-08
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公开(公告)号： US06171436B2公开(公告)日： 2001-01-09
- 发明人: Cuc K. Huynh , Harold G. Linde , Patricia E. Marmillion , Anthony M. Palagonia , Bernadette A. Pierson , Matthew J. Rutten
- 申请人： Cuc K. Huynh , Harold G. Linde , Patricia E. Marmillion , Anthony M. Palagonia , Bernadette A. Pierson , Matthew J. Rutten
- 主分类号： C23F102
- IPC分类号： C23F102
摘要：
Disclosed is a method and apparatus for polishing a semiconductor wafer. This invention describes a novel in situ method for eliminating residual slurry and slurry abrasive particles on the wafer. A reactant is added to the slurry during the end of the Chemical Mechanical Polish (CMP) process to dissolve the slurry and etch the abrasive particles.
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