发明授权
US06180187B2 Method of making an electronic component using reworkable underfill encapsulants
有权
使用可再加工的底部填充密封剂制造电子部件的方法
- 专利标题： Method of making an electronic component using reworkable underfill encapsulants
- 专利标题（中）： 使用可再加工的底部填充密封剂制造电子部件的方法
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申请号： US09469479申请日： 1999-12-22
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公开(公告)号： US06180187B2公开(公告)日： 2001-01-30
- 发明人: Bodan Ma , Quinn K. Tong , Chaodong Xiao
- 申请人： Bodan Ma , Quinn K. Tong , Chaodong Xiao
- 主分类号： C08J704
- IPC分类号： C08J704
摘要：
A method is disclosed for preparing an electronic assembly using a reworkable underfill encapsulant in which the encapsulant is cured in situ from a curable composition comprising one or more mono-functional maleimide compounds, or one or more mono-functional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, a curing initiator and optionally, one or more fillers or adhesion promoters.