发明授权
US06180468B2 Very low thermal budget channel implant process for semiconductors
有权
用于半导体的非常低的热预算通道注入工艺
- 专利标题: Very low thermal budget channel implant process for semiconductors
- 专利标题(中): 用于半导体的非常低的热预算通道注入工艺
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申请号: US09177774申请日: 1998-10-23
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公开(公告)号: US06180468B2公开(公告)日: 2001-01-30
- 发明人: Bin Yu , Emi Ishida , Scott Luning , Timothy Thurgate
- 申请人: Bin Yu , Emi Ishida , Scott Luning , Timothy Thurgate
- 主分类号: H01L21336
- IPC分类号: H01L21336
摘要:
An ultra-low thermal budget process is provided for channel implant by using a reverse process sequence where a conventional MOS transistor is formed without the channel implant. The originally deposited polysilicon gate is removed, a nitride film deposition and etch is used to form a nitride spacer with a predetermined configuration, and a self-aligned channel implant is performed. After the channel implantation, anneal and super-retrograded doping, the nitride spacer and the gate oxide are removed for subsequent regrowth of a second gate oxide and a polysilicon deposition to form a second polysilicon gate.
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