发明授权
US06180468B2 Very low thermal budget channel implant process for semiconductors 有权
用于半导体的非常低的热预算通道注入工艺

Very low thermal budget channel implant process for semiconductors
摘要:
An ultra-low thermal budget process is provided for channel implant by using a reverse process sequence where a conventional MOS transistor is formed without the channel implant. The originally deposited polysilicon gate is removed, a nitride film deposition and etch is used to form a nitride spacer with a predetermined configuration, and a self-aligned channel implant is performed. After the channel implantation, anneal and super-retrograded doping, the nitride spacer and the gate oxide are removed for subsequent regrowth of a second gate oxide and a polysilicon deposition to form a second polysilicon gate.
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