发明授权
- 专利标题： Method of supplying a chemical mechanical polishing liquid and apparatus therefor
- 专利标题（中）： 化学机械抛光液的供给方法及其设备
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申请号： US09292685申请日： 1999-04-15
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公开(公告)号： US06183351B2公开(公告)日： 2001-02-06
- 发明人: Hidemitsu Aoki
- 申请人： Hidemitsu Aoki
- 优先权： JP10-105104 19980415
- 主分类号： B24B5704
- IPC分类号： B24B5704
摘要：
The first present invention provides an apparatus for activating a polishing liquid including polishing particles and hydrogen peroxide for carrying out a chemical mechanical polishing method to a surface of a wafer to be polished, wherein the apparatus comprises an ultraviolet ray irradiation system for an irradiation of an ultraviolet ray to the polishing liquid.
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