Invention Grant
- Patent Title: Apparatus for extracting chips from slots cut into a substrate
- Patent Title (中): 用于从切割成基板的切屑中提取碎屑的装置
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Application No.: US09317583Application Date: 1999-05-24
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Publication No.: US06196775B1Publication Date: 2001-03-06
- Inventor: Paul D. Aubin , Wolfgang M. Strobel
- Applicant: Paul D. Aubin , Wolfgang M. Strobel
- Main IPC: B23Q1100
- IPC: B23Q1100

Abstract:
In an apparatus for extracting chips from slots cut into a substrate, a cutter having a cutting implement is mounted thereon and is adapted to cut slots into the substrate. At least one injector is positioned proximate to the cutting implement, and includes a nozzle having a nozzle tip directed at the slots such that during operation a current of gas is directed into the slots to loosen any substrate chips therefrom which were generated during the cutting operation. A vacuum apparatus is positioned proximate to the cutting apparatus for capturing and removing the substrate chips loosened by the injector.
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