Invention Grant
US06197601B1 Method of correcting temperature of semiconductor substrate 失效
校正半导体衬底温度的方法

  • Patent Title: Method of correcting temperature of semiconductor substrate
  • Patent Title (中): 校正半导体衬底温度的方法
  • Application No.: US09427085
    Application Date: 1999-10-26
  • Publication No.: US06197601B1
    Publication Date: 2001-03-06
  • Inventor: Norio Hirashita
  • Applicant: Norio Hirashita
  • Priority: JP10-310537 19981030
  • Main IPC: H01L2100
  • IPC: H01L2100
Method of correcting temperature of semiconductor substrate
Abstract:
In a semiconductor manufacturing apparatus, a semiconductor substrate ion-implanted with an ion species is heated and thereby raised in temperature under vacuum. At this time, a partial pressure of a gas released from the semiconductor substrate is measured by a quadrupole mass spectrometer. Further, a change in partial pressure with time is observed and compared with a pre-measured release characteristic, whereby the temperature of the semiconductor substrate is corrected.
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