发明授权
- 专利标题： Modular semiconductor workpiece processing tool
- 专利标题（中）： 模块化半导体工件加工工具
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申请号： US08680068申请日： 1996-07-15
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公开(公告)号： US06203582B1公开(公告)日： 2001-03-20
- 发明人: Robert W. Berner , Daniel J. Woodruff , Wayne J. Schmidt , Kevin W. Coyle , Vladimir Zila , Worm Lund
- 申请人： Robert W. Berner , Daniel J. Woodruff , Wayne J. Schmidt , Kevin W. Coyle , Vladimir Zila , Worm Lund
- 主分类号： H01L2100
- IPC分类号： H01L2100
摘要：
The present invention provides for a semiconductor workpiece processing tool. The semiconductor workpiece processing tool includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool has a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.
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