发明授权
- 专利标题： Method for manufacturing semiconductor components having micromechanical structures
- 专利标题（中）： 制造具有微机械结构的半导体部件的方法
-
申请号： US09038777申请日： 1998-03-11
-
公开(公告)号： US06204086B1公开(公告)日： 2001-03-20
- 发明人: Joerg Muchow , Helmut Baumann
- 申请人： Joerg Muchow , Helmut Baumann
- 优先权： DE19710324 19970313
- 主分类号： H01L2100
- IPC分类号： H01L2100
摘要：
A method for manufacturing semiconductor components having micromechanical structures, micromechanical structures being patterned in a wafer for detecting a physical quantity acting on micromechanical structures, and semiconductor components for converting the physical quantity into an electrical signal proportional to the physical quantity being produced. The semiconductor components and the micromechanical structures are defined in a self-aligning manner by process steps acting on one side of the wafer to produce semiconductor components.
信息查询
