发明授权
US06204343B1 Room temperature curable resin 失效
室温固化树脂

Room temperature curable resin
摘要:
A curable composition for electrical applications, the curable composition comprising (i) a compound having at least two &agr;,&bgr;-unsaturated groups and an equivalent weight of less than 250 g/mol, (ii) a catalyst capable of initiating a Michael reaction and (iii) a Michael donor having an equivalent weight of less than 250 g/mol, and a package for using this composition in electical splices.
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