发明授权
US06207541B1 Method employing silicon nitride spacers for making an integrated circuit device 有权
采用氮化硅间隔物制造集成电路器件的方法

  • 专利标题: Method employing silicon nitride spacers for making an integrated circuit device
  • 专利标题(中): 采用氮化硅间隔物制造集成电路器件的方法
  • 申请号: US09465549
    申请日: 1999-12-16
  • 公开(公告)号: US06207541B1
    公开(公告)日: 2001-03-27
  • 发明人: Siddhartha DasChunlin Liang
  • 申请人: Siddhartha DasChunlin Liang
  • 主分类号: H01L213205
  • IPC分类号: H01L213205
Method employing silicon nitride spacers for making an integrated circuit device
摘要:
A process for patterning a gate of a semiconductor device is provided. A gate material layer is formed upon an oxide layer of a substrate. A photoresist layer is formed upon the gate material layer. A portion of the photoresist layer is photo oxidized. The portion defines a gate pattern. The portion of the photoresist layer is converted into a hard mask. A portion of the gate material layer is patterned with the hard mask. The portion of the gate material layer defines a gate.
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