发明授权
- 专利标题： Polishing apparatus and method of manufacturing a semiconductor device using the same
- 专利标题（中）： 抛光装置及其制造方法
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申请号： US09350920申请日： 1999-07-12
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公开(公告)号： US06213852B1公开(公告)日： 2001-04-10
- 发明人: Kazuyuki Fujii , Takanori Sasaki , Mahito Sawada , Kouichiro Tsutahara
- 申请人： Kazuyuki Fujii , Takanori Sasaki , Mahito Sawada , Kouichiro Tsutahara
- 优先权： JP11-018245 19990127
- 主分类号： B24B2900
- IPC分类号： B24B2900
摘要：
A method of manufacturing a semiconductor device using a polishing apparatus is provided. A top ring holding a wafer is arranged on a pad. A polishing chemical liquid supply line for supplying a polishing chemical liquid is arranged above the pad in a direction ahead of rotation with respect to the top ring. Around the center of rotation of the pad, a partition plate having a columnar side surface is arranged. Above the pad on a side which goes away from the top ring when the pad is rotated, a polishing chemical liquid draining mechanism is arranged extending continuously from the partition plate to the outer periphery of the pad. Accordingly, a polishing apparatus is obtained by which the amount of polishing of the surface to be polished of the semiconductor substrate is stabilized and generation of microscratches on the surface to be polished can be suppressed.