发明授权
- 专利标题： Device and method for forming semiconductor interconnections in an integrated circuit substrate
- 专利标题（中）： 在集成电路基板中形成半导体互连的装置和方法
-
申请号： US09150529申请日： 1998-09-10
-
公开(公告)号： US06215158B1公开(公告)日： 2001-04-10
- 发明人: Seungmoo Choi
- 申请人： Seungmoo Choi
- 主分类号： H01L2940
- IPC分类号： H01L2940
摘要：
The present invention provides a semiconductor device, formed on a semiconductor wafer, comprising a tub, first and second active areas, and an interconnect. In one aspect of the present invention, the tub is formed in the substrate of the semiconductor wafer and first and second active areas are in contact with the tub. In one advantageous embodiment, the interconnect is formed in the tub and is in electrical contact with the first and second active areas. The interconnect extends from the first active area to the second active area to electrically connect the first and second active areas.
信息查询
