Invention Grant
- Patent Title: Resin composition comprising polyamide resin
- Patent Title (中): 包含聚酰胺树脂的树脂组合物
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Application No.: US09198613Application Date: 1998-11-24
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Publication No.: US06225383B1Publication Date: 2001-05-01
- Inventor: Masaki Hirono , Noriyoshi Watanabe
- Applicant: Masaki Hirono , Noriyoshi Watanabe
- Priority: JP10-292521 19981014; JP10-292530 19981014
- Main IPC: C08K534
- IPC: C08K534
Abstract:
The present invention relates to a resin composition comprising: 100 parts by weight of resin component comprising a polyamide resin or a polyamide resin and a thermoplastic resin other than polyamide resins, and 1 to 50 parts by weight of a salt of polyphosphoric acid and melam or a melam derivative, a salt of polyphosphoric acid and melem or a melem derivative or a mixture thereof.
Information query
