发明授权
- 专利标题: Light-emitting diode array and method for fabricating the same
- 专利标题(中): 发光二极管阵列及其制造方法
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申请号: US08948246申请日: 1997-10-09
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公开(公告)号: US06236065B1公开(公告)日: 2001-05-22
- 发明人: Takahisa Kurahashi , Masahiko Sakata
- 申请人: Takahisa Kurahashi , Masahiko Sakata
- 优先权: JP6-200529 19940825
- 主分类号: H01L3300
- IPC分类号: H01L3300
摘要:
The light-emitting diode array of the invention includes: a semiconductor substrate of a first conductivity type and a plurality of light-emitting elements linearly arranged on the substrate of the first conductivity type. Each of the plurality of light-emitting elements includes: a cladding layer of the first conductivity type; a cladding layer of a second conductivity type; an (AlxGa1−x)yIn1−yP (where 0≦x≦1 and 0≦y≦1) active layer interposed between the cladding layer of the first conductivity type and the cladding layer of the second conductivity type; and a current diffusion layer of the second conductivity type deposited on the cladding layer of the second conductivity type. In the light-emitting diode array, at least the current diffusion layer of the second conductivity type and the cladding layer of the second conductivity type are electrically isolated from each other in two adjacent light-emitting elements among the plurality of light-emitting elements.
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