A MOSFET die is mounted onto the bottom surface of a lead frame pad of a lead frame which has increased heat conducting capacity. The pad includes a plurality of at least four integral pins extending therefrom. The lead frame also includes isolated pins which are connected to the MOSFET source and drain using wire bonds. The lead frame and MOSFET are molded in a housing. The pins extend outside the molded housing for external connection, and the pins extending from the lead frame pad provide a path for heat removal from the MOSFET by a heat conduction path formed of the MOSFET drain electrode, the lead frame pad, their interconnection material and the pins.