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    Power module
    2.
    发明授权
    Power module 失效
    电源模块

    公开(公告)号：US06800934B2

    公开(公告)日：2004-10-05

    申请号：US10189561

    申请日：2002-07-08

    申请人： Takeshi Oumaru

    发明人： Takeshi Oumaru

    IPC分类号： H01L2334

    CPC分类号： H05K7/1432 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2924/01079 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A power module having a plurality of power devices arranged in parallel with each other and switched by gate signals with substantially equal electric potential. The power module includes: a collector electrode pattern, first and second power devices provided on the collector electrode pattern and each having a collector electrode connected to the collector electrode pattern; an emitter electrode pattern provided along the collector electrode pattern and having an emitter lead, and first and second connection means for connecting emitter electrodes on the first and second power devices and the emitter electrode pattern, respectively. The power module is characterized in that an inductance component of at least one of the first and second connection means is adjusted so that the inductance component between the emitter electrode on the first power device and the emitter lead is substantially equal to that between the emitter electrode on the second power device and the emitter lead.

    摘要翻译： 一种功率模块，具有彼此并联布置的多个功率器件，并且具有基本相等的电位的栅极信号切换。 功率模块包括：集电极图案，设置在集电极图案上的每个具有与集电极图案连接的集电极的第一和第二功率元件; 沿着集电极图案设置并具有发射极引线的发射极电极图案，以及用于分别连接第一和第二功率器件上的发射极和发射极电极图案的第一和第二连接装置。 功率模块的特征在于，调节第一和第二连接装置中的至少一个的电感分量，使得第一功率器件上的发射极和发射极之间的电感分量基本上等于发射极之间的电感分量 在第二功率器件和发射极引线上。

    Flip-chip package substrate
    4.
    发明授权
    Flip-chip package substrate 有权
    倒装芯片封装基板

    公开(公告)号：US06777804B1

    公开(公告)日：2004-08-17

    申请号：US10605356

    申请日：2003-09-25

    申请人： Chi-Hsing Hsu

    发明人： Chi-Hsing Hsu

    IPC分类号： H01L2334

    CPC分类号： H01L23/50 ,  H01L23/3128 ,  H01L23/49838 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/112 ,  H05K3/4602 ,  H05K2201/09227 ,  H05K2201/10674 ,  H01L2224/05599

    摘要： A flip-chip package has a first surface and a corresponding second surface. The chip is adapted to be disposed on the first surface of the substrate and electrically connected to the substrate. The chip has a centerline, which evenly divides the chip into two equal parts. The substrate has a peripheral connection-pad layout region disposed on the second surface of the substrate. The peripheral connection-pad layout region has a centerline neighboring region which the centerline of the chip traverses. The substrate also has a plurality of central connection pads disposed in the centerline neighboring region. Within the centerline neighboring region, at both sides of the centerline of the chip is respectively lined with the central connection pads in three rows. The central connection pads in each row are lined in parallel to the direction extending the centerline. The ratio of the number of the central connection pads for transmitting signals to the total number of the central connection pads is equal to or less than {fraction (2/7)}.

    摘要翻译： 倒装芯片封装具有第一表面和相应的第二表面。 芯片适于布置在基板的第一表面上并电连接到基板。 芯片具有中心线，将芯片均匀分为两个相等的部分。 衬底具有设置在衬底的第二表面上的外围连接焊盘布局区域。 外围连接焊盘布局区域具有芯片的中心线穿过的中心线相邻区域。 衬底还具有设置在中心线相邻区域中的多个中心连接焊盘。 在中心线相邻区域内，在芯片的中心线的两侧分别以中心连接垫排成三列。 每排中心连接垫与延伸中心线的方向平行排列。 用于发送信号的中央连接焊盘的数量与中央连接焊盘的总数的比例等于或小于{分数（2/7）。

    Remote thermal vias for densely packed electrical assemblage
    5.
    发明授权
    Remote thermal vias for densely packed electrical assemblage 有权
    用于密集电气组合的远程热通孔

    公开(公告)号：US06770967B2

    公开(公告)日：2004-08-03

    申请号：US10328332

    申请日：2002-12-23

    申请人： Tina P. Barcley

    发明人： Tina P. Barcley

    IPC分类号： H01L2334

    CPC分类号： H05K1/0206 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K3/0061 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10689 ,  H01L2924/00

    摘要： A densely packed electronic assemblage has a substrate medium for supporting at least one heat generating component and means for reducing the temperature of the at least one heat generating component. A heat sink cooperates with the at least one heat removing element for reducing heat of the heat generating component by absorbing heat from the at least one heat generating component.

    摘要翻译： 密集封装的电子组件具有用于支撑至少一个发热部件的基板介质和用于降低至少一个发热部件的温度的装置。 散热器与至少一个除热元件配合，用于通过吸收来自至少一个发热部件的热量来减少发热部件的热量。

    Molded substrate stiffener with embedded capacitors
    7.
    发明授权
    Molded substrate stiffener with embedded capacitors 有权
    带嵌入式电容器的模压基板加强筋

    公开(公告)号：US06710444B2

    公开(公告)日：2004-03-23

    申请号：US10101739

    申请日：2002-03-21

    申请人： Hong Xie ,  Debendra Mallik

    发明人： Hong Xie ,  Debendra Mallik

    IPC分类号： H01L2334

    CPC分类号： H01L23/16 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0231 ,  H05K1/0271 ,  H05K3/284 ,  H05K2201/2009

    摘要： A molded stiffener for a package substrate is presented. The stiffener includes a molded portion. The molded portion is molded of an electrically nonconductive molding compound. A plurality of capacitors are embedded in the molded portion. The capacitors are constructed and arranged to be electrically connected to the package substrate. As such, power delivery performance is improved, and mechanical strength is added to the substrate.

    摘要翻译： 提出了一种用于封装衬底的模制加强件。 加强件包括模制部分。 模制部分由不导电的模塑料模制而成。 多个电容器嵌入在模制部分中。 电容器被构造和布置成电连接到封装衬底。 因此，功率输送性能提高，并且机械强度被添加到基板。

    INTEGRATED CIRCUIT PROVIDING THERMALLY CONDUCTIVE STRUCTURES SUBSTANTIALLY HORIZONTALLY COUPLED TO ONE ANOTHER WITHIN ONE OR MORE HEAT DISSIPATION LAYERS TO DISSIPATE HEAT FROM A HEAT GENERATING STRUCTURE
    8.
    发明授权
    INTEGRATED CIRCUIT PROVIDING THERMALLY CONDUCTIVE STRUCTURES SUBSTANTIALLY HORIZONTALLY COUPLED TO ONE ANOTHER WITHIN ONE OR MORE HEAT DISSIPATION LAYERS TO DISSIPATE HEAT FROM A HEAT GENERATING STRUCTURE 有权
    集成电路在一个或多个散热层中大幅度地耦合到另一个热导电结构，以将热量从热生成结构中分离出来

    公开(公告)号：US06710443B1

    公开(公告)日：2004-03-23

    申请号：US10326612

    申请日：2002-12-20

    申请人： Timothy A. Rost ,  William R. Hunter ,  Bradley S. Young

    发明人： Timothy A. Rost ,  William R. Hunter ,  Bradley S. Young

    IPC分类号： H01L2334

    CPC分类号： H01L23/367 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311

    摘要： In one embodiment, an integrated circuit includes a heat generating structure within a dielectric region and one or more substantially horizontally arranged heat dissipation layers within the dielectric region. Each heat dissipation layer includes electrically inactive thermally conductive structures, at least two such structures in at least one such layer being substantially horizontally connected and thermally coupled to one another within the layer. The electrically inactive thermally conductive structures cooperate to facilitate dissipation of heat from the heat generating structure. In another embodiment, an integrated circuit includes one or more heat generating structures within a dielectric region and electrically inactive thermal posts formed at least partially within the dielectric region. At least one such post is substantially horizontally connected and thermally coupled to another such post. The electrically inactive thermal posts cooperate to facilitate dissipation of heat from the one or more heat generating structures.

    摘要翻译： 在一个实施例中，集成电路包括电介质区域内的发热结构和电介质区域内的一个或多个基本水平布置的散热层。 每个散热层包括电惰性导热结构，至少一个这样的层中的至少两个这样的结构基本上水平连接并且在该层内彼此热耦合。 电惰性的导热结构协同作用以促进来自发热结构的热量的散发。 在另一个实施例中，集成电路包括电介质区域内的一个或多个发热结构和至少部分地形成在电介质区域内的电活性热柱。 至少一个这样的柱基本上水平连接并且热耦合到另一个这样的柱。 电惰性的热柱配合以便于从一个或多个发热结构散发热量。

    Programmable multi-chip module
    10.
    发明授权
    Programmable multi-chip module 有权
    可编程多芯片模块

    公开(公告)号：US06700196B1

    公开(公告)日：2004-03-02

    申请号：US10253851

    申请日：2002-09-23

    申请人： David Kautz ,  Howard Morgenstern ,  Roy J. Blazek

    发明人： David Kautz ,  Howard Morgenstern ,  Roy J. Blazek

    IPC分类号： H01L2334

    CPC分类号： H05K1/181 ,  H01L22/22 ,  H01L2924/0002 ,  H05K1/0286 ,  H05K1/0306 ,  H05K1/141 ,  H05K3/284 ,  H05K2201/10386 ,  H05K2201/10636 ,  H05K2203/1572 ,  H05K2203/176 ,  Y02P70/611 ,  H01L2924/00

    摘要： A multi-chip module comprising a low-temperature co-fired ceramic substrate having a first side on which are mounted active components and a second side on which are mounted passive components, wherein this segregation of components allows for hermetically sealing the active components with a cover while leaving accessible the passive components, and wherein the passive components are secured using a reflow soldering technique and are removable and replaceable so as to make the multi-chip module substantially programmable with regard to the passive components.

    摘要翻译： 一种多芯片模块，包括具有第一侧的低温共烧陶瓷基板，其上安装有有源部件，第二侧安装有无源部件，其中部件的这种偏析允许用一个 盖，同时使无源部件可接近，并且其中使用回流焊接技术来固定无源部件，并且是可拆卸和可更换的，以使得多芯片模块基本上可被无源组件编程。