A method of assembling a pressed joint between an integrated circuit module and a temperature regulating unit includes the steps of: 1) providing the integrated circuit module with a contact surface of a first material and providing the temperature regulating unit with a contact surface of a second material; 2) coating the contact surface of the temperature regulating unit with a metal alloy which adheres in a solid state to the second material but not the first material; 3) heating the metal alloy to a slurry/liquid state; and 4) squeezing the slurry/liquid alloy between the contact surfaces on the integrated circuit module and the temperature regulating unit. To disassemble the pressed joint between the integrated circuit module and the temperature regulating unit, without any residue of the metal alloy being transferred from the joint to the integrated circuit module, the alloy is cooled to a solid state; and then, the integrated circuit module is separated from the temperature regulating unit with the alloy adhered in the solid state to just the second material on the contact surface of the temperature regulating unit.