发明授权
- 专利标题： Method for removing particles from a semiconductor wafer
- 专利标题（中）： 从半导体晶片去除颗粒的方法
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申请号： US09150220申请日： 1998-09-09
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公开(公告)号： US06248180B1公开(公告)日： 2001-06-19
- 发明人: Nobuyoshi Sato , Hideaki Seto , Koji Ohsawa , Haruhiko Yamamoto
- 申请人： Nobuyoshi Sato , Hideaki Seto , Koji Ohsawa , Haruhiko Yamamoto
- 优先权： JP9-251840 19970917
- 主分类号： B08B100
- IPC分类号： B08B100
摘要：
A method of removing particles adhering to a surface of a semiconductor wafer including the steps of: providing a container having a drain valve; positioning the semiconductor wafer in the container; directing a jet stream consisting of water against the surface of the semiconductor wafer; removing particles adhering to the surface of the semiconductor wafer by scrubbing the surface of the semiconductor wafer with a brush while the jet stream of water is directed against the surface of the semiconductor wafer; closing the drain valve while the jet stream of water is directed against the semiconductor wafer, wherein the water accumulates in the container to thereby completely immerse the brush and the semiconductor wafer in the water in the container; and maintaining the brush and the semiconductor wafer completely immersed in the water from the jet stream for a predetermined period of time.
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