发明授权
- 专利标题： Adhesive for electroless plating, raw material composition for preparing adhesive for electroless plating and printed wiring board
- 专利标题（中）： 化学镀用粘合剂，化学镀用粘合剂用原料组合物及印刷线路板
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申请号： US09402477申请日： 1999-10-12
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公开(公告)号： US06248428B1公开(公告)日： 2001-06-19
- 发明人: Motoo Asai , Yoshitaka Ono , Masato Kawade , Kouta Noda , Youko Nishiwaki
- 申请人： Motoo Asai , Yoshitaka Ono , Masato Kawade , Kouta Noda , Youko Nishiwaki
- 优先权： JP9-97735 19970415; JP9-155201 19970612; JP9-335466 19971205
- 主分类号： B32B300
- IPC分类号： B32B300
摘要：
Adhesive adhesive for electroless plating ensures insulation reliabilities between lines and between layers while maintaining a practical peel strength, and a printed circuit board using the adhesive are disclosed. The adhesive is formed by dispersing cured heat-resistant resin particles soluble in acid or oxidizing agent into uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent through curing treatment, in which the heat-resistant resin particles have an average particle size of not more than 2 &mgr;m, and comprised of rough particles and fine particles.
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